* Add kicad library for flat programming clip
* Add descriptions to part symbols
* Add extended values, manufacturer/distributor info to components in mta1
* Add new board entry for TK1
* Add TP1 programmer design
* Update MTA1-USB-V1 release files to match production
* Change SPI flash memory type to XT25F08BDFIGT-S
* Change touch sensor feedback cap to 1uF
* Add manufacturer, manufacturer part number, distributor, distributor part number
* Update component values for TK1 PCB
* Use specific part # for C8
* Change flash back to Winbond part, for easier sourcing
* Change C1 to 1pF
* Fixes for production programmer PCB
* Swap GND and 5V on J3
* Replace graphic logo with text
* Rename part to 'TP-1'
* TK-1 release
* Add dimensions for PCB
* Add layer stackup for PCB
* Change PCB component origin to match expanded board
* Change schematic title to 'TK-1', update release date
* mta1-usb-v1-programmer: Add corrected part numbers for OSFC production
* Q1, Q2, F1 part subsititutions
* add mfr/supplier info for all parts
* PCB library: add parts
* Rectangular footprint for TK-1 test pads
* BOM generation script used for TK-1 and TP-1 releases
* TP-1 release
* Schematic: Add manufacturer, supplier information for all parts
* Schematic: Update name and release date
* PCB: Add PCB fabrication information
* PCB: Correct pinouts on silkscreen
* PCB library: add 'screw' and 'foot' symbols
* Screw is a schematic-only part, for including mechanical screws in the
BOM
* Foot is for self-adhesive rubber mounting feet that can be stuck to
the bottom of a PCB
* TP-1 release: Add screws, feet to the BOM
* Pico library: Add footprint for RPi Pico w/solder paste
* TP-1 RevA release updates:
* Add fiducials in 3 corners (1mm exposed copper ring w/2mm soldermask opening)
* Add solder paste openings to Raspberry Pi Pico pads
* TK-1: RevA.1 release
* Add two fiducials to TK-1 board
* TP-1: Update fuse type to match actual part
* Make placement diagrams for TP-1, TK-1
* Update BC-1-xxx footprints to include placement outlines
* Update TP-1 PCB with new footprints, clean up top fab layer
* Take screenshots of top layers of both boards
* tk-1: fix placement footprints
* Add pin1 marking for ncp footprint
* Add refdes for w25q80 footprint
* Update board with new footprints, clear extraneous text on fab layer
In firmware we store the address to firmware blake2s() function at
TK1_MMIO_TK1_BLAKE2S so app can use this firmware function sort of
like a system call but without context switch.
We introduce an explicit state machine (see README).
With the new states we:
- combine setting size and USS to a single command.
- start the device app immediatiely when having receceived the last
data chunk and returning the digest.
- Loop forever and wait for the stick to be removed if we end up in
unknown state.
Signed-off-by: Michael Cardell Widerkrantz <mc@tillitis.se>
Since SRAM has some data remanence even without power it seems good
hygien to clear all RAM when starting the device so as not to leak
potential sensitive data between device apps.
