mirror of
https://github.com/tillitis/tillitis-key1.git
synced 2024-07-11 13:52:16 +00:00
e71d70008b
* Add kicad library for flat programming clip * Add descriptions to part symbols * Add extended values, manufacturer/distributor info to components in mta1 * Add new board entry for TK1 * Add TP1 programmer design * Update MTA1-USB-V1 release files to match production * Change SPI flash memory type to XT25F08BDFIGT-S * Change touch sensor feedback cap to 1uF * Add manufacturer, manufacturer part number, distributor, distributor part number * Update component values for TK1 PCB * Use specific part # for C8 * Change flash back to Winbond part, for easier sourcing * Change C1 to 1pF * Fixes for production programmer PCB * Swap GND and 5V on J3 * Replace graphic logo with text * Rename part to 'TP-1' * TK-1 release * Add dimensions for PCB * Add layer stackup for PCB * Change PCB component origin to match expanded board * Change schematic title to 'TK-1', update release date * mta1-usb-v1-programmer: Add corrected part numbers for OSFC production * Q1, Q2, F1 part subsititutions * add mfr/supplier info for all parts * PCB library: add parts * Rectangular footprint for TK-1 test pads * BOM generation script used for TK-1 and TP-1 releases * TP-1 release * Schematic: Add manufacturer, supplier information for all parts * Schematic: Update name and release date * PCB: Add PCB fabrication information * PCB: Correct pinouts on silkscreen * PCB library: add 'screw' and 'foot' symbols * Screw is a schematic-only part, for including mechanical screws in the BOM * Foot is for self-adhesive rubber mounting feet that can be stuck to the bottom of a PCB * TP-1 release: Add screws, feet to the BOM * Pico library: Add footprint for RPi Pico w/solder paste * TP-1 RevA release updates: * Add fiducials in 3 corners (1mm exposed copper ring w/2mm soldermask opening) * Add solder paste openings to Raspberry Pi Pico pads * TK-1: RevA.1 release * Add two fiducials to TK-1 board * TP-1: Update fuse type to match actual part * Make placement diagrams for TP-1, TK-1 * Update BC-1-xxx footprints to include placement outlines * Update TP-1 PCB with new footprints, clean up top fab layer * Take screenshots of top layers of both boards * tk-1: fix placement footprints * Add pin1 marking for ncp footprint * Add refdes for w25q80 footprint * Update board with new footprints, clear extraneous text on fab layer
132 lines
2.7 KiB
Plaintext
132 lines
2.7 KiB
Plaintext
{
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"Header": {
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"GenerationSoftware": {
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"Vendor": "KiCad",
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"Application": "Pcbnew",
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"Version": "(6.0.4)"
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},
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"CreationDate": "2022-11-15T10:47:26+01:00"
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},
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"GeneralSpecs": {
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"ProjectId": {
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"Name": "tp1",
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"GUID": "7470312e-6b69-4636-9164-5f7063625858",
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"Revision": "rev?"
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},
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"Size": {
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"X": 45.1,
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"Y": 87.0929
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},
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"LayerNumber": 2,
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"BoardThickness": 1.6,
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"Finish": "ENIG"
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},
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"DesignRules": [
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{
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"Layers": "Outer",
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"PadToPad": 0.0,
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"PadToTrack": 0.0,
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"TrackToTrack": 0.2,
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"MinLineWidth": 0.2,
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"TrackToRegion": 0.508,
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"RegionToRegion": 0.508
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}
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],
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"FilesAttributes": [
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{
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"Path": "tp1-F_Cu.gbr",
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"FileFunction": "Copper,L1,Top",
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"FilePolarity": "Positive"
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},
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{
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"Path": "tp1-B_Cu.gbr",
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"FileFunction": "Copper,L2,Bot",
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"FilePolarity": "Positive"
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},
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{
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"Path": "tp1-F_Paste.gbr",
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"FileFunction": "SolderPaste,Top",
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"FilePolarity": "Positive"
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},
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{
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"Path": "tp1-B_Paste.gbr",
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"FileFunction": "SolderPaste,Bot",
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"FilePolarity": "Positive"
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},
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{
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"Path": "tp1-F_Silkscreen.gbr",
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"FileFunction": "Legend,Top",
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"FilePolarity": "Positive"
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},
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{
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"Path": "tp1-B_Silkscreen.gbr",
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"FileFunction": "Legend,Bot",
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"FilePolarity": "Positive"
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},
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{
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"Path": "tp1-F_Mask.gbr",
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"FileFunction": "SolderMask,Top",
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"FilePolarity": "Negative"
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},
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{
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"Path": "tp1-B_Mask.gbr",
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"FileFunction": "SolderMask,Bot",
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"FilePolarity": "Negative"
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},
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{
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"Path": "tp1-Edge_Cuts.gbr",
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"FileFunction": "Profile",
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"FilePolarity": "Positive"
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}
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],
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"MaterialStackup": [
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{
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"Type": "Legend",
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"Color": "White",
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"Name": "Top Silk Screen"
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},
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{
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"Type": "SolderPaste",
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"Name": "Top Solder Paste"
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},
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{
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"Type": "SolderMask",
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"Color": "Black",
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"Thickness": 0.01,
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"Name": "Top Solder Mask"
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},
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{
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"Type": "Copper",
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"Thickness": 0.035,
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"Name": "F.Cu"
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},
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{
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"Type": "Dielectric",
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"Thickness": 1.51,
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"Material": "FR4",
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"Name": "F.Cu/B.Cu",
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"Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)"
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},
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{
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"Type": "Copper",
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"Thickness": 0.035,
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"Name": "B.Cu"
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},
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{
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"Type": "SolderMask",
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"Color": "Black",
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"Thickness": 0.01,
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"Name": "Bottom Solder Mask"
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},
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{
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"Type": "SolderPaste",
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"Name": "Bottom Solder Paste"
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},
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{
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"Type": "Legend",
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"Color": "White",
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"Name": "Bottom Silk Screen"
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}
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]
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}
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