mirror of
https://github.com/tillitis/tillitis-key1.git
synced 2024-10-01 01:45:38 -04:00
e71d70008b
* Add kicad library for flat programming clip * Add descriptions to part symbols * Add extended values, manufacturer/distributor info to components in mta1 * Add new board entry for TK1 * Add TP1 programmer design * Update MTA1-USB-V1 release files to match production * Change SPI flash memory type to XT25F08BDFIGT-S * Change touch sensor feedback cap to 1uF * Add manufacturer, manufacturer part number, distributor, distributor part number * Update component values for TK1 PCB * Use specific part # for C8 * Change flash back to Winbond part, for easier sourcing * Change C1 to 1pF * Fixes for production programmer PCB * Swap GND and 5V on J3 * Replace graphic logo with text * Rename part to 'TP-1' * TK-1 release * Add dimensions for PCB * Add layer stackup for PCB * Change PCB component origin to match expanded board * Change schematic title to 'TK-1', update release date * mta1-usb-v1-programmer: Add corrected part numbers for OSFC production * Q1, Q2, F1 part subsititutions * add mfr/supplier info for all parts * PCB library: add parts * Rectangular footprint for TK-1 test pads * BOM generation script used for TK-1 and TP-1 releases * TP-1 release * Schematic: Add manufacturer, supplier information for all parts * Schematic: Update name and release date * PCB: Add PCB fabrication information * PCB: Correct pinouts on silkscreen * PCB library: add 'screw' and 'foot' symbols * Screw is a schematic-only part, for including mechanical screws in the BOM * Foot is for self-adhesive rubber mounting feet that can be stuck to the bottom of a PCB * TP-1 release: Add screws, feet to the BOM * Pico library: Add footprint for RPi Pico w/solder paste * TP-1 RevA release updates: * Add fiducials in 3 corners (1mm exposed copper ring w/2mm soldermask opening) * Add solder paste openings to Raspberry Pi Pico pads * TK-1: RevA.1 release * Add two fiducials to TK-1 board * TP-1: Update fuse type to match actual part * Make placement diagrams for TP-1, TK-1 * Update BC-1-xxx footprints to include placement outlines * Update TP-1 PCB with new footprints, clean up top fab layer * Take screenshots of top layers of both boards * tk-1: fix placement footprints * Add pin1 marking for ncp footprint * Add refdes for w25q80 footprint * Update board with new footprints, clear extraneous text on fab layer
39 lines
2.7 KiB
Plaintext
39 lines
2.7 KiB
Plaintext
(footprint "NCP752BSN33T1G" (version 20211014) (generator pcbnew)
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(layer "F.Cu")
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(tedit 616ECE40)
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(attr smd)
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(fp_text reference "REF**" (at 0 -3.81) (layer "F.SilkS")
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(effects (font (size 1 1) (thickness 0.15)))
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(tstamp ea5a20bb-c640-47a9-806f-cebd20350c6e)
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)
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(fp_text value "NCP752BSN33T1G" (at 0 3.81) (layer "F.Fab")
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(effects (font (size 1 1) (thickness 0.15)))
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(tstamp 68f3b860-6277-4b0a-881d-06899522ea17)
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)
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(fp_text user "${REFERENCE}" (at 0 0 90 unlocked) (layer "F.Fab")
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(effects (font (size 0.5 0.5) (thickness 0.08)))
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(tstamp 86e3dd9b-559d-4b3e-8aa4-cf49dc238d9c)
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)
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(fp_line (start -0.9 1.61) (end 0.9 1.61) (layer "F.SilkS") (width 0.12) (tstamp 6e5cefcf-65ad-4263-b0f7-e81767e10695))
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(fp_line (start 0.9 -1.61) (end -1.55 -1.61) (layer "F.SilkS") (width 0.12) (tstamp e95f7615-6547-498d-94da-56b2857a02ea))
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(fp_line (start 1.9 -1.5) (end 1.9 1.5) (layer "F.CrtYd") (width 0.05) (tstamp 61c34542-af3e-42b6-b288-c86e516c35ea))
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(fp_line (start -1.9 -1.5) (end 1.9 -1.5) (layer "F.CrtYd") (width 0.05) (tstamp 9548cf5b-a09a-4505-894a-a92b90eefa07))
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(fp_line (start -1.9 1.5) (end -1.9 -1.5) (layer "F.CrtYd") (width 0.05) (tstamp a7ade3c5-1d11-4e28-9c66-d7a3210fe984))
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(fp_line (start 1.9 1.5) (end -1.9 1.5) (layer "F.CrtYd") (width 0.05) (tstamp cea10542-7924-4256-bef1-d9e9c146e1f5))
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(fp_line (start -0.825 1.575) (end -0.825 -1.2) (layer "F.Fab") (width 0.12) (tstamp 856fa11c-f489-4642-99c6-d2369520cc75))
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(fp_line (start -0.5 -1.575) (end 0.825 -1.575) (layer "F.Fab") (width 0.12) (tstamp 8a15ba15-f0c9-4c69-b0c7-f497dae6fff5))
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(fp_line (start 0.825 -1.575) (end 0.825 1.575) (layer "F.Fab") (width 0.12) (tstamp aab352ee-93c2-4186-9af0-a86a8c96089a))
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(fp_line (start 0.825 1.575) (end -0.825 1.575) (layer "F.Fab") (width 0.1) (tstamp d8648659-e0f3-4371-b3af-4ff643c2b44e))
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(fp_line (start -0.5 -1.575) (end -0.825 -1.2) (layer "F.Fab") (width 0.12) (tstamp f5d5f9c7-cd53-432e-87df-bf2dacc807c7))
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(pad "1" smd rect (at -1.2 -0.95 270) (size 0.7 1) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp ea245e44-4956-45b1-b440-bef9b1d8a885))
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(pad "2" smd rect (at -1.2 0 270) (size 0.7 1) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 86cdc1d7-fdb3-4ffc-9f6f-cf5282c31d3b))
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(pad "3" smd rect (at -1.2 0.95 270) (size 0.7 1) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 5bff8781-6551-4141-995b-343fb5aa90ae))
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(pad "4" smd rect (at 1.2 0.95 270) (size 0.7 1) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 59005e90-31b3-4c2d-b870-1409713c62cf))
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(pad "5" smd rect (at 1.2 -0.95 270) (size 0.7 1) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 28707e0a-dd24-4294-bf8c-5773a9252ade))
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(model "${KICAD6_3DMODEL_DIR}/Package_TO_SOT_SMD.3dshapes/TSOT-23-5.wrl"
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(offset (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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)
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)
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