mirror of
https://github.com/tillitis/tillitis-key1.git
synced 2024-10-01 01:45:38 -04:00
e71d70008b
* Add kicad library for flat programming clip * Add descriptions to part symbols * Add extended values, manufacturer/distributor info to components in mta1 * Add new board entry for TK1 * Add TP1 programmer design * Update MTA1-USB-V1 release files to match production * Change SPI flash memory type to XT25F08BDFIGT-S * Change touch sensor feedback cap to 1uF * Add manufacturer, manufacturer part number, distributor, distributor part number * Update component values for TK1 PCB * Use specific part # for C8 * Change flash back to Winbond part, for easier sourcing * Change C1 to 1pF * Fixes for production programmer PCB * Swap GND and 5V on J3 * Replace graphic logo with text * Rename part to 'TP-1' * TK-1 release * Add dimensions for PCB * Add layer stackup for PCB * Change PCB component origin to match expanded board * Change schematic title to 'TK-1', update release date * mta1-usb-v1-programmer: Add corrected part numbers for OSFC production * Q1, Q2, F1 part subsititutions * add mfr/supplier info for all parts * PCB library: add parts * Rectangular footprint for TK-1 test pads * BOM generation script used for TK-1 and TP-1 releases * TP-1 release * Schematic: Add manufacturer, supplier information for all parts * Schematic: Update name and release date * PCB: Add PCB fabrication information * PCB: Correct pinouts on silkscreen * PCB library: add 'screw' and 'foot' symbols * Screw is a schematic-only part, for including mechanical screws in the BOM * Foot is for self-adhesive rubber mounting feet that can be stuck to the bottom of a PCB * TP-1 release: Add screws, feet to the BOM * Pico library: Add footprint for RPi Pico w/solder paste * TP-1 RevA release updates: * Add fiducials in 3 corners (1mm exposed copper ring w/2mm soldermask opening) * Add solder paste openings to Raspberry Pi Pico pads * TK-1: RevA.1 release * Add two fiducials to TK-1 board * TP-1: Update fuse type to match actual part * Make placement diagrams for TP-1, TK-1 * Update BC-1-xxx footprints to include placement outlines * Update TP-1 PCB with new footprints, clean up top fab layer * Take screenshots of top layers of both boards * tk-1: fix placement footprints * Add pin1 marking for ncp footprint * Add refdes for w25q80 footprint * Update board with new footprints, clear extraneous text on fab layer
22 lines
832 B
Plaintext
22 lines
832 B
Plaintext
(version 1)
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# Larger clearance on outer layers (inner layer clearance set by board minimum clearance)
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# For Eurocircuits 6 layer: minimum inner layer isolation distance is .125mm (vs 0.100mm for outer layers)
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(rule "clearance_inner"
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(layer inner)
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(constraint clearance (min 0.125mm)))
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# For Eurocircuits: inner layer tracks hae a minimum width of 0.125mm (vs 0.100mm for outer layers)
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# This rule is disabled since the global track width is set to 0.125mm.
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#(rule "track_width_inner"
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# (layer inner)
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# (constraint track_width (min 0.125mm)))
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# For Eurocircuits:
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# outer layer feature-to-board spacing is 0.25mm for routed edges.
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# inner layer feature-to-board spacing is 0.45mm for routed edges.
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(rule "edge_clearance_inner"
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(layer inner)
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(constraint clearance (min 0.45mm))
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(condition "A.Type == 'Graphic'"))
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