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Move the boards folder to new repositories

Browse Source 
To simplify versioning and isolate the different parts of the projects
to their own repositories, these hardware parts are moved to separate
locations.

- tk1, mta1-usb-dev, mta-usb-v1 and mta1-library moves to
  https://github.com/tillitis/tk1-pcba
- tp1, mta1-usb-programmer, mta1-library and KiCad-RP Pico moves to
  https://github.com/tillitis/tp1
- Relevant documentation referring to these boards are also moved to the
  new repositories, links are updated to point to the new location
- The CERN-OHL-S license is removed from this repo
- CI is no longer building the TP1 firmware
This commit is contained in:
Daniel Jobson 2024-09-20 10:59:11 +02:00 committed by Michael Cardell Widerkrantz
parent f66617431b
commit 559924868e
No known key found for this signature in database
GPG Key ID: D3DB3DDF57E704E5
248 changed files with 22 additions and 1117561 deletions
Show Stats Download Patch File Download Diff File Expand all files Collapse all files

6
.github/workflows/ci.yaml vendored
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@ -61,7 +61,7 @@ jobs:
working-directory: hw/application_fpga
run: make lint
build-other-firmwares:
build-usb-firmware:
runs-on: ubuntu-latest
container:
image: ghcr.io/tillitis/tkey-builder:4
@ -81,10 +81,6 @@ jobs:
working-directory: hw/usb_interface/ch552_fw
run: make
- name: compile tp1 firmware
working-directory: hw/boards/tp1/firmware
run: ./build.sh
build-bitstream:
outputs:
commit_sha: ${{ github.sha }}

19
.gitignore vendored
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@ -45,22 +45,3 @@ application_fpga_par.txt
.*.swp
*.sch-bak
*.sim
# Ignore list for KiCAD Projects
*.000
*.bak
*.bck
*.kicad_pcb-bak
*.sch-bak
_autosave-*
*-backups
\#auto_saved_files#
*.tmp
*-save.pro
*-save.kicad_pcb
fp-info-cache
*.net
*.dsn
*.ses
__pycache__
MEM.TXT

4
LICENSES/README.md
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@ -3,9 +3,7 @@
## Main license
Unless otherwise noted, the project sources are licensed under the
terms and conditions of the "GNU General Public License v2.0 only" and
hardware boards under "CERN Open Hardware Licence Version 2 - Strongly
Reciprocal".
terms and conditions of the "GNU General Public License v2.0 only".
The `LICENSES/` directory contains copies of the license texts used by
the sources included in the project source tree.

289
LICENSES/cern-ohl-v2.txt
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@ -1,289 +0,0 @@
CERN Open Hardware Licence Version 2 - Strongly Reciprocal
Preamble
CERN has developed this licence to promote collaboration among
hardware designers and to provide a legal tool which supports the
freedom to use, study, modify, share and distribute hardware designs
and products based on those designs. Version 2 of the CERN Open
Hardware Licence comes in three variants: CERN-OHL-P (permissive); and
two reciprocal licences: CERN-OHL-W (weakly reciprocal) and this
licence, CERN-OHL-S (strongly reciprocal).
The CERN-OHL-S is copyright CERN 2020. Anyone is welcome to use it, in
unmodified form only.
Use of this Licence does not imply any endorsement by CERN of any
Licensor or their designs nor does it imply any involvement by CERN in
their development.
1 Definitions
1.1 'Licence' means this CERN-OHL-S.
1.2 'Compatible Licence' means
a) any earlier version of the CERN Open Hardware licence, or
b) any version of the CERN-OHL-S, or
c) any licence which permits You to treat the Source to which
it applies as licensed under CERN-OHL-S provided that on
Conveyance of any such Source, or any associated Product You
treat the Source in question as being licensed under
CERN-OHL-S.
1.3 'Source' means information such as design materials or digital
code which can be applied to Make or test a Product or to
prepare a Product for use, Conveyance or sale, regardless of its
medium or how it is expressed. It may include Notices.
1.4 'Covered Source' means Source that is explicitly made available
under this Licence.
1.5 'Product' means any device, component, work or physical object,
whether in finished or intermediate form, arising from the use,
application or processing of Covered Source.
1.6 'Make' means to create or configure something, whether by
manufacture, assembly, compiling, loading or applying Covered
Source or another Product or otherwise.
1.7 'Available Component' means any part, sub-assembly, library or
code which:
a) is licensed to You as Complete Source under a Compatible
Licence; or
b) is available, at the time a Product or the Source containing
it is first Conveyed, to You and any other prospective
licensees
i) as a physical part with sufficient rights and
information (including any configuration and
programming files and information about its
characteristics and interfaces) to enable it either to
be Made itself, or to be sourced and used to Make the
Product; or
ii) as part of the normal distribution of a tool used to
design or Make the Product.
1.8 'Complete Source' means the set of all Source necessary to Make
a Product, in the preferred form for making modifications,
including necessary installation and interfacing information
both for the Product, and for any included Available Components.
If the format is proprietary, it must also be made available in
a format (if the proprietary tool can create it) which is
viewable with a tool available to potential licensees and
licensed under a licence approved by the Free Software
Foundation or the Open Source Initiative. Complete Source need
not include the Source of any Available Component, provided that
You include in the Complete Source sufficient information to
enable a recipient to Make or source and use the Available
Component to Make the Product.
1.9 'Source Location' means a location where a Licensor has placed
Covered Source, and which that Licensor reasonably believes will
remain easily accessible for at least three years for anyone to
obtain a digital copy.
1.10 'Notice' means copyright, acknowledgement and trademark notices,
Source Location references, modification notices (subsection
3.3(b)) and all notices that refer to this Licence and to the
disclaimer of warranties that are included in the Covered
Source.
1.11 'Licensee' or 'You' means any person exercising rights under
this Licence.
1.12 'Licensor' means a natural or legal person who creates or
modifies Covered Source. A person may be a Licensee and a
Licensor at the same time.
1.13 'Convey' means to communicate to the public or distribute.
2 Applicability
2.1 This Licence governs the use, copying, modification, Conveying
of Covered Source and Products, and the Making of Products. By
exercising any right granted under this Licence, You irrevocably
accept these terms and conditions.
2.2 This Licence is granted by the Licensor directly to You, and
shall apply worldwide and without limitation in time.
2.3 You shall not attempt to restrict by contract or otherwise the
rights granted under this Licence to other Licensees.
2.4 This Licence is not intended to restrict fair use, fair dealing,
or any other similar right.
3 Copying, Modifying and Conveying Covered Source
3.1 You may copy and Convey verbatim copies of Covered Source, in
any medium, provided You retain all Notices.
3.2 You may modify Covered Source, other than Notices, provided that
You irrevocably undertake to make that modified Covered Source
available from a Source Location should You Convey a Product in
circumstances where the recipient does not otherwise receive a
copy of the modified Covered Source. In each case subsection 3.3
shall apply.
You may only delete Notices if they are no longer applicable to
the corresponding Covered Source as modified by You and You may
add additional Notices applicable to Your modifications.
Including Covered Source in a larger work is modifying the
Covered Source, and the larger work becomes modified Covered
Source.
3.3 You may Convey modified Covered Source (with the effect that You
shall also become a Licensor) provided that You:
a) retain Notices as required in subsection 3.2;
b) add a Notice to the modified Covered Source stating that You
have modified it, with the date and brief description of how
You have modified it;
c) add a Source Location Notice for the modified Covered Source
if You Convey in circumstances where the recipient does not
otherwise receive a copy of the modified Covered Source; and
d) license the modified Covered Source under the terms and
conditions of this Licence (or, as set out in subsection
8.3, a later version, if permitted by the licence of the
original Covered Source). Such modified Covered Source must
be licensed as a whole, but excluding Available Components
contained in it, which remain licensed under their own
applicable licences.
4 Making and Conveying Products
You may Make Products, and/or Convey them, provided that You either
provide each recipient with a copy of the Complete Source or ensure
that each recipient is notified of the Source Location of the Complete
Source. That Complete Source is Covered Source, and You must
accordingly satisfy Your obligations set out in subsection 3.3. If
specified in a Notice, the Product must visibly and securely display
the Source Location on it or its packaging or documentation in the
manner specified in that Notice.
5 Research and Development
You may Convey Covered Source, modified Covered Source or Products to
a legal entity carrying out development, testing or quality assurance
work on Your behalf provided that the work is performed on terms which
prevent the entity from both using the Source or Products for its own
internal purposes and Conveying the Source or Products or any
modifications to them to any person other than You. Any modifications
made by the entity shall be deemed to be made by You pursuant to
subsection 3.2.
6 DISCLAIMER AND LIABILITY
6.1 DISCLAIMER OF WARRANTY -- The Covered Source and any Products
are provided 'as is' and any express or implied warranties,
including, but not limited to, implied warranties of
merchantability, of satisfactory quality, non-infringement of
third party rights, and fitness for a particular purpose or use
are disclaimed in respect of any Source or Product to the
maximum extent permitted by law. The Licensor makes no
representation that any Source or Product does not or will not
infringe any patent, copyright, trade secret or other
proprietary right. The entire risk as to the use, quality, and
performance of any Source or Product shall be with You and not
the Licensor. This disclaimer of warranty is an essential part
of this Licence and a condition for the grant of any rights
granted under this Licence.
6.2 EXCLUSION AND LIMITATION OF LIABILITY -- The Licensor shall, to
the maximum extent permitted by law, have no liability for
direct, indirect, special, incidental, consequential, exemplary,
punitive or other damages of any character including, without
limitation, procurement of substitute goods or services, loss of
use, data or profits, or business interruption, however caused
and on any theory of contract, warranty, tort (including
negligence), product liability or otherwise, arising in any way
in relation to the Covered Source, modified Covered Source
and/or the Making or Conveyance of a Product, even if advised of
the possibility of such damages, and You shall hold the
Licensor(s) free and harmless from any liability, costs,
damages, fees and expenses, including claims by third parties,
in relation to such use.
7 Patents
7.1 Subject to the terms and conditions of this Licence, each
Licensor hereby grants to You a perpetual, worldwide,
non-exclusive, no-charge, royalty-free, irrevocable (except as
stated in subsections 7.2 and 8.4) patent licence to Make, have
Made, use, offer to sell, sell, import, and otherwise transfer
the Covered Source and Products, where such licence applies only
to those patent claims licensable by such Licensor that are
necessarily infringed by exercising rights under the Covered
Source as Conveyed by that Licensor.
7.2 If You institute patent litigation against any entity (including
a cross-claim or counterclaim in a lawsuit) alleging that the
Covered Source or a Product constitutes direct or contributory
patent infringement, or You seek any declaration that a patent
licensed to You under this Licence is invalid or unenforceable
then any rights granted to You under this Licence shall
terminate as of the date such process is initiated.
8 General
8.1 If any provisions of this Licence are or subsequently become
invalid or unenforceable for any reason, the remaining
provisions shall remain effective.
8.2 You shall not use any of the name (including acronyms and
abbreviations), image, or logo by which the Licensor or CERN is
known, except where needed to comply with section 3, or where
the use is otherwise allowed by law. Any such permitted use
shall be factual and shall not be made so as to suggest any kind
of endorsement or implication of involvement by the Licensor or
its personnel.
8.3 CERN may publish updated versions and variants of this Licence
which it considers to be in the spirit of this version, but may
differ in detail to address new problems or concerns. New
versions will be published with a unique version number and a
variant identifier specifying the variant. If the Licensor has
specified that a given variant applies to the Covered Source
without specifying a version, You may treat that Covered Source
as being released under any version of the CERN-OHL with that
variant. If no variant is specified, the Covered Source shall be
treated as being released under CERN-OHL-S. The Licensor may
also specify that the Covered Source is subject to a specific
version of the CERN-OHL or any later version in which case You
may apply this or any later version of CERN-OHL with the same
variant identifier published by CERN.
8.4 This Licence shall terminate with immediate effect if You fail
to comply with any of its terms and conditions.
8.5 However, if You cease all breaches of this Licence, then Your
Licence from any Licensor is reinstated unless such Licensor has
terminated this Licence by giving You, while You remain in
breach, a notice specifying the breach and requiring You to cure
it within 30 days, and You have failed to come into compliance
in all material respects by the end of the 30 day period. Should
You repeat the breach after receipt of a cure notice and
subsequent reinstatement, this Licence will terminate
immediately and permanently. Section 6 shall continue to apply
after any termination.
8.6 This Licence shall not be enforceable except by a Licensor
acting as such, and third party beneficiary rights are
specifically excluded.

27
README.md
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@ -56,7 +56,7 @@ Specific documentation regarding implementation is kept close to the
code/design in README files, typically in the same directory.
## Tkey Device Apps
Offically supported apps can be found at
Officially supported apps can be found at
[tillitis.se](https://tillitis.se/download/)
The source and other projects from us can be found here at our
@ -65,14 +65,24 @@ The source and other projects from us can be found here at our
Other known (but not all) projects can be found at
[dev.tillitis.se](https://dev.tillitis.se/projects/).
### Other noteworthy links
## PCB and programmer
The TKey PCB [KiCad](https://www.kicad.org/) design files are kept in
a separate repository:
https://github.com/tillitis/tk1-pcba
The TP1 (TKey programmer 1) PCB design files and firmware are kept in:
https://github.com/tillitis/tp1
## Other noteworthy links
* [Threat Model](doc/threat_model/threat_model.md)
* [Release Notes](doc/release_notes.md)
* [Quickstart for the DevKit](doc/quickstart.md). Initial programming
if you have the "old" DevKit.
Note that development is ongoing. To avoid unexpected changes of
derived key material, please use a tagged release. Read the [Release
Notes](doc/release_notes.md) to keep up to date with changes and new
@ -80,12 +90,13 @@ releases.
## About this repository
This repository contains hardware, firmware and utilities written as
part of the TKey. It is structured as monolithic repository, or
"monorepo", where all components live in one repository.
This repository contains the FPGA design, firmware/bootloader, and the
USB controller firmware.
Device and client applications, however, are kept in other
repositories here at our [GitHub](https://github.com/tillitis).
The PCB design files, device and client applications are kept in other
repositories. See:
https://github.com/tillitis
## Licensing

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doc/system_description/boards.md
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@ -1,94 +0,0 @@
# Tillitis PCB designs
## Introduction
Tillitis develop boards (PCBs) and enclposures for the TKey devices as
well support systems such as FPGA programmers. Tillitis use open source
tools for the PCB designs.
## Boards
The KiCad board projects all follow this directory structure:
| Path | Description |
| --- | --- |
| /project | KiCad 6 project |
| /project/gerbers | PCB release files |
| /project/test | Scripts / gateware used for production tests |
### TKey 1 (TK1)
![](../../doc/images/mta1-usb-v1.jpg)
This is the first production version of the TKey design.
Main features:
* Miniaturized hardware the size of a small USB stick.
* The Interface FPGA from the MTA1-USB-DEV design has been replaced with an Interface
MCU running a USB-to-Serial converter firmware. This was done to ease development
of the FPGA design.
* A touch sensor IC is provided instead of the switch for user presence detection.
* Test pads are provided on the bottom of the board for programming the SPI flash,
and also for measuring extra GPIO pins. The 'MTA1-USB-V1-Programmer' board is
designed to support this.
### mta1-usb-v1-programmer
![](../../doc/images/mta1-usb-v1-programmer.jpg)
This is a programming jig for TKey 1 (the mta1-usb-v1) board The progamming board is based
around a on a Raspberry Pi Pico running a custom firmware developed by Blinkinlabs.
The source code for this firnware [is available on Github](https://github.com/Blinkinlabs/ice40_flasher).
There is also a [pre built firmware binary available for the programmer board](https://github.com/Blinkinlabs/ice40_flasher/tree/main/bin)
### mta1-usb-dev
![](../../doc/images/mta1-usb-dev.jpg)
This is the original TKey design, intended as a development platform. It is a larger PCB,
that connects to a PC via a USB C cable.
Main features:
* 2 ICE40 FPGAs.
* The first ICE40 (Interface FPGA) is connected to a USB C plug, and is loaded with a
gateware that contains a soft USB device. This gateware acts as an USB-to-GPIO
interface to the second ICE40.
* The second ICE40 (application FPGA) is loaded with a RISC-V soft core containing
the security firmware. User applications are run on this gateware.
* The second ICE40 also has an input button for user presenence detection.
* An FTDI module is included for programming both the Application and Interface FPGAs.
* Both ICE40s can be configured to boot from included SPI flash memories, NVCM,
or be live programmed from the FTDI module.
* All GPIO lines between the two FPGAs, as well as all programming signals, are
exposed on 0.1" headers for probing.
## Libraries
### mta1-library
This is a shared KiCad library for all boards in the project.
### KiCad-RP Pico
This is a KiCad library for the Raspberry Pi Pico symbol and footprint. It was extracted from
the [Kicad-RP-Pico](https://github.com/ncarandini/KiCad-RP-Pico) project. It is licensed under
the [Creative Commons CC-BY-SA 4.0 License](https://creativecommons.org/licenses/by-sa/4.0/legalcode),
with an exception exempting waving any control of derived works.
---

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doc/toolchain_setup.md
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@ -56,7 +56,7 @@ Bus 001 Device 023: ID 1209:8886 Generic TP-1
```
Then, you can check the permissions by using the bus and device
number reported above. Note that this pair is ephimeral and may
number reported above. Note that this pair is ephemeral and may
change after every device insertion:
```
@ -137,54 +137,6 @@ If your available `objcopy` and `size` commands is anything other than
the default `llvm-objcopy` and `llvm-size` define `OBJCOPY` and `SIZE`
to whatever they're called on your system before calling `make`.
## Circuit board designs: KiCad 6.0
The circuit board designs were all created in [KiCad
6.0](https://www.kicad.org/).
## MTA1-USB-V1 and TP-1 programming board firmware
The TP-1 programming boards runs a custom firmware developed by
Blinkinlabs. Source code for this firmware can be found at
[hw/boards/tp1/firmware/](../hw/boards/tp1/firmware/). There is also a
pre-built firmware binary at
[hw/boards/tp1/firmware/bin/main.uf2](../hw/boards/tp1/firmware/bin/main.uf2).
To update the firmware on the programmer board, either build the file
`main.uf2` (more instructions below), or get the pre-built file to
your host computer. Then do the following:
1. Disconnect the programming board from the host computer
2. Press and hold the "BOOTSEL" button on the RPi2040 sub-board on the
programming board
3. Reconnect the programming board to the host computer
4. Release the "BOOTSEL" button after connecting the programming board
to the host. The board should now appear to the host as a USB
connected storage device
5. Open the storage device and drop the firmware file `main.uf2` into
the storage device
The programmer will update its firmware with the file and restart
itself. After reboot the storage device will automatically be
disconnected.
### Building the TP-1 firmware
The firmware requires the Raspberry Pi Pico SDK:
cd ~
git clone --branch 1.5.0 https://github.com/raspberrypi/pico-sdk.git
cd pico-sdk
git submodule update --init
Note that our container image places the pico-sdk directory in
/usr/local. For normal development, it is usually left in the
users home directory.
See
[hw/boards/tp1/firmware/README.md](../hw/boards/tp1/firmware/README.md)
for further instructions.
## CH552 USB to Serial firmware
The USB to Serial firmware runs on the CH552 microcontroller, and

27
hw/boards/KiCad-RP Pico/LICENSE
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@ -1,27 +0,0 @@
### TPCWare KiCad Library License
The TPCWare KiCad Library is licensed under the [Creative Commons CC-BY-SA 4.0 License](https://creativecommons.org/licenses/by-sa/4.0/legalcode), with the following exception:
---------
_To the extent that the creation of electronic designs that use 'Licensed Material' can be considered to be 'Adapted Material', then the copyright holder waives article 3 of the license with respect to these designs and any generated files which use data provided as part of the 'Licensed Material'._
---------
**What does this mean?**
TPCWare KiCad Library is licensed in such a way to ensure free use of library data for commercial, closed, and non-commercial projects without restriction. TPCWare Corporation does not wish to exert any control over designs produced using the library data, or force users to reveal proprietary information contained in their designs. Neither do we wish to force users to attribute the TPCWare KiCad Library _within their design_.
Use of the library data in a project does not (by itself) require that the design or any files generated from the design are licensed under the CC-BY-SA 4.0 License. You are free to use the library data in your own projects without the obligation to share your project files under this or any other license agreement.
However, if you wish to redistribute the TPCWare KiCad Library, or parts thereof (including in modified form) as a collection then the exception above does not apply. Redistributed library collections must be shared under the same license agreement. Under these circumstances, the libraries must also retain attribution information, including the license documents which are distributed with the library files.
----------------------
**Disclaimer of Warranties and Limitation of Liability.**
a. Unless otherwise separately undertaken by the Licensor, to the extent possible, the Licensor offers the Licensed Material as-is and as-available, and makes no representations or warranties of any kind concerning the Licensed Material, whether express, implied, statutory, or other. This includes, without limitation, warranties of title, merchantability, fitness for a particular purpose, non-infringement, absence of latent or other defects, accuracy, or the presence or absence of errors, whether or not known or discoverable. Where disclaimers of warranties are not allowed in full or in part, this disclaimer may not apply to You.
b. To the extent possible, in no event will the Licensor be liable to You on any legal theory (including, without limitation, negligence) or otherwise for any direct, special, indirect, incidental, consequential, punitive, exemplary, or other losses, costs, expenses, or damages arising out of this Public License or use of the Licensed Material, even if the Licensor has been advised of the possibility of such losses, costs, expenses, or damages. Where a limitation of liability is not allowed in full or in part, this limitation may not apply to You.
c. The disclaimer of warranties and limitation of liability provided above shall be interpreted in a manner that, to the extent possible, most closely approximates an absolute disclaimer and waiver of all liability.

8
hw/boards/KiCad-RP Pico/README.md
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@ -1,8 +0,0 @@
# KiCad-RP-Pico
A simple repository of files needed to add a 3D footprint of the Raspberry Pi Pico board to KiCad.
Adapted from https://github.com/ncarandini/KiCad-RP-Pico
## License
Please read the [License](LICENSE) where is stated that this work is free to use.
A tweet with an image of your Raspberry Pi Pico project with a link this project and me (@tpcware) would be greatly appreciated.

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hw/boards/KiCad-RP Pico/RP-Pico-Libraries/MCU_RaspberryPi_and_Boards.kicad_sym
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@ -1,201 +0,0 @@
(kicad_symbol_lib (version 20211014) (generator kicad_symbol_editor)
(symbol "Pico" (in_bom yes) (on_board yes)
(property "Reference" "U" (id 0) (at -13.97 27.94 0)
(effects (font (size 1.27 1.27)))
)
(property "Value" "Pico" (id 1) (at 0 19.05 0)
(effects (font (size 1.27 1.27)))
)
(property "Footprint" "RPi_Pico:RPi_Pico_SMD_TH" (id 2) (at 0 0 90)
(effects (font (size 1.27 1.27)) hide)
)
(property "Datasheet" "" (id 3) (at 0 0 0)
(effects (font (size 1.27 1.27)) hide)
)
(symbol "Pico_0_0"
(text "Raspberry Pi Pico" (at 0 21.59 0)
(effects (font (size 1.27 1.27)))
)
)
(symbol "Pico_0_1"
(rectangle (start -15.24 26.67) (end 15.24 -26.67)
(stroke (width 0) (type default) (color 0 0 0 0))
(fill (type background))
)
)
(symbol "Pico_1_1"
(pin bidirectional line (at -17.78 24.13 0) (length 2.54)
(name "GPIO0" (effects (font (size 1.27 1.27))))
(number "1" (effects (font (size 1.27 1.27))))
)
(pin bidirectional line (at -17.78 1.27 0) (length 2.54)
(name "GPIO7" (effects (font (size 1.27 1.27))))
(number "10" (effects (font (size 1.27 1.27))))
)
(pin bidirectional line (at -17.78 -1.27 0) (length 2.54)
(name "GPIO8" (effects (font (size 1.27 1.27))))
(number "11" (effects (font (size 1.27 1.27))))
)
(pin bidirectional line (at -17.78 -3.81 0) (length 2.54)
(name "GPIO9" (effects (font (size 1.27 1.27))))
(number "12" (effects (font (size 1.27 1.27))))
)
(pin power_in line (at -17.78 -6.35 0) (length 2.54)
(name "GND" (effects (font (size 1.27 1.27))))
(number "13" (effects (font (size 1.27 1.27))))
)
(pin bidirectional line (at -17.78 -8.89 0) (length 2.54)
(name "GPIO10" (effects (font (size 1.27 1.27))))
(number "14" (effects (font (size 1.27 1.27))))
)
(pin bidirectional line (at -17.78 -11.43 0) (length 2.54)
(name "GPIO11" (effects (font (size 1.27 1.27))))
(number "15" (effects (font (size 1.27 1.27))))
)
(pin bidirectional line (at -17.78 -13.97 0) (length 2.54)
(name "GPIO12" (effects (font (size 1.27 1.27))))
(number "16" (effects (font (size 1.27 1.27))))
)
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)

153
hw/boards/KiCad-RP Pico/RP-Pico-Libraries/MCU_RaspberryPi_and_Boards.pretty/RPi_Pico_SMD.kicad_mod
View File

@ -1,153 +0,0 @@
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(pad "19" smd rect (at -8.89 21.59) (size 3.5 1.7) (drill (offset -0.9 0)) (layers "F.Cu" "F.Mask") (tstamp 275b6416-db29-42cc-9307-bf426917c3b4))
(pad "20" smd rect (at -8.89 24.13) (size 3.5 1.7) (drill (offset -0.9 0)) (layers "F.Cu" "F.Mask") (tstamp 3c22d605-7855-4cc6-8ad2-906cadbd02dc))
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(pad "22" smd rect (at 8.89 21.59) (size 3.5 1.7) (drill (offset 0.9 0)) (layers "F.Cu" "F.Mask") (tstamp 13ac70df-e9b9-44e5-96e6-20f0b0dc6a3a))
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(pad "41" smd rect (at -2.54 23.9 90) (size 3.5 1.7) (drill (offset -0.9 0)) (layers "F.Cu" "F.Mask") (tstamp b21299b9-3c4d-43df-b399-7f9b08eb5470))
(pad "42" smd rect (at 0 23.9 90) (size 3.5 1.7) (drill (offset -0.9 0)) (layers "F.Cu" "F.Mask") (tstamp 751d823e-1d7b-4501-9658-d06d459b0e16))
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(model "${KIPRJMOD}/../KiCad-RP Pico/RP-Pico-Libraries/Pico.wrl"
(offset (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)

153
hw/boards/KiCad-RP Pico/RP-Pico-Libraries/MCU_RaspberryPi_and_Boards.pretty/RPi_Pico_SMD_reflow.kicad_mod
View File

@ -1,153 +0,0 @@
(footprint "RPi_Pico_SMD_reflow" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 6224DF39)
(descr "Through hole straight pin header, 2x20, 2.54mm pitch, double rows")
(tags "Through hole pin header THT 2x20 2.54mm double row")
(attr through_hole)
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(effects (font (size 1 1) (thickness 0.15)))
(tstamp 96315415-cfed-47d2-b3dd-d782358bd0df)
)
(fp_text value "RPi_Pico_SMD_reflow" (at 0 2.159) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 46cbe85d-ff47-428e-b187-4ebd50a66e0c)
)
(fp_text user "Copper Keepouts shown on Dwgs layer" (at 0.1 -30.2) (layer "Cmts.User")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 66ca01b3-51ff-4294-9b77-4492e98f6aec)
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(fp_text user "${REFERENCE}" (at 0 0 180) (layer "F.Fab")
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(tstamp 83184391-76ed-44f0-8cd0-01f89f157bdb)
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(pad "3" smd rect (at -8.89 -19.05) (size 3.5 1.7) (drill (offset -0.9 0)) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 7233cb6b-d8fd-4fcd-9b4f-8b0ed19b1b12))
(pad "4" smd rect (at -8.89 -16.51) (size 3.5 1.7) (drill (offset -0.9 0)) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp df83f395-2d18-47e2-a370-952ca41c2b3a))
(pad "5" smd rect (at -8.89 -13.97) (size 3.5 1.7) (drill (offset -0.9 0)) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 653a86ba-a1ae-4175-9d4c-c788087956d0))
(pad "6" smd rect (at -8.89 -11.43) (size 3.5 1.7) (drill (offset -0.9 0)) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 3ed2c840-383d-4cbd-bc3b-c4ea4c97b333))
(pad "7" smd rect (at -8.89 -8.89) (size 3.5 1.7) (drill (offset -0.9 0)) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 6a0919c2-460c-4229-b872-14e318e1ba8b))
(pad "8" smd rect (at -8.89 -6.35) (size 3.5 1.7) (drill (offset -0.9 0)) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp d1c19c11-0a13-4237-b6b4-fb2ef1db7c6d))
(pad "9" smd rect (at -8.89 -3.81) (size 3.5 1.7) (drill (offset -0.9 0)) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 29cbb0bc-f66b-4d11-80e7-5bb270e42496))
(pad "10" smd rect (at -8.89 -1.27) (size 3.5 1.7) (drill (offset -0.9 0)) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp c401e9c6-1deb-4979-99be-7c801c952098))
(pad "11" smd rect (at -8.89 1.27) (size 3.5 1.7) (drill (offset -0.9 0)) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 355ced6c-c08a-4586-9a09-7a9c624536f6))
(pad "12" smd rect (at -8.89 3.81) (size 3.5 1.7) (drill (offset -0.9 0)) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp c2dd13db-24b6-40f1-b75b-b9ab893d92ea))
(pad "13" smd rect (at -8.89 6.35) (size 3.5 1.7) (drill (offset -0.9 0)) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp d8200a86-aa75-47a3-ad2a-7f4c9c999a6f))
(pad "14" smd rect (at -8.89 8.89) (size 3.5 1.7) (drill (offset -0.9 0)) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 465137b4-f6f7-4d51-9b40-b161947d5cc1))
(pad "15" smd rect (at -8.89 11.43) (size 3.5 1.7) (drill (offset -0.9 0)) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp d1cd5391-31d2-459f-8adb-4ae3f304a833))
(pad "16" smd rect (at -8.89 13.97) (size 3.5 1.7) (drill (offset -0.9 0)) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 4086cbd7-6ba7-4e63-8da9-17e60627ee17))
(pad "17" smd rect (at -8.89 16.51) (size 3.5 1.7) (drill (offset -0.9 0)) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp bb8162f0-99c8-4884-be5b-c0d0c7e81ff6))
(pad "18" smd rect (at -8.89 19.05) (size 3.5 1.7) (drill (offset -0.9 0)) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 91fc5800-6029-46b1-848d-ca0091f97267))
(pad "19" smd rect (at -8.89 21.59) (size 3.5 1.7) (drill (offset -0.9 0)) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 275b6416-db29-42cc-9307-bf426917c3b4))
(pad "20" smd rect (at -8.89 24.13) (size 3.5 1.7) (drill (offset -0.9 0)) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 3c22d605-7855-4cc6-8ad2-906cadbd02dc))
(pad "21" smd rect (at 8.89 24.13) (size 3.5 1.7) (drill (offset 0.9 0)) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 24adc223-60f0-4497-98a3-d664c5a13280))
(pad "22" smd rect (at 8.89 21.59) (size 3.5 1.7) (drill (offset 0.9 0)) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 13ac70df-e9b9-44e5-96e6-20f0b0dc6a3a))
(pad "23" smd rect (at 8.89 19.05) (size 3.5 1.7) (drill (offset 0.9 0)) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 278a91dc-d57d-4a5c-a045-34b6bd84131f))
(pad "24" smd rect (at 8.89 16.51) (size 3.5 1.7) (drill (offset 0.9 0)) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 98966de3-2364-43d8-a2e0-b03bb9487b03))
(pad "25" smd rect (at 8.89 13.97) (size 3.5 1.7) (drill (offset 0.9 0)) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 4cc0e615-05a0-4f42-a208-4011ba8ef841))
(pad "26" smd rect (at 8.89 11.43) (size 3.5 1.7) (drill (offset 0.9 0)) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 4641c87c-bffa-41fe-ae77-be3a97a6f797))
(pad "27" smd rect (at 8.89 8.89) (size 3.5 1.7) (drill (offset 0.9 0)) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp da546d77-4b03-4562-8fc6-837fd68e7691))
(pad "28" smd rect (at 8.89 6.35) (size 3.5 1.7) (drill (offset 0.9 0)) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp e2fac877-439c-4da0-af2e-5fdc70f85d42))
(pad "29" smd rect (at 8.89 3.81) (size 3.5 1.7) (drill (offset 0.9 0)) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 2ea8fa6f-efc3-40fe-bcf9-05bfa46ead4f))
(pad "30" smd rect (at 8.89 1.27) (size 3.5 1.7) (drill (offset 0.9 0)) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 9da1ace0-4181-4f12-80f8-16786a9e5c07))
(pad "31" smd rect (at 8.89 -1.27) (size 3.5 1.7) (drill (offset 0.9 0)) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 29126f72-63f7-4275-8b12-6b96a71c6f17))
(pad "32" smd rect (at 8.89 -3.81) (size 3.5 1.7) (drill (offset 0.9 0)) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp af186015-d283-4209-aade-a247e5de01df))
(pad "33" smd rect (at 8.89 -6.35) (size 3.5 1.7) (drill (offset 0.9 0)) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 8d063f79-9282-4820-bcf4-1ff3c006cf08))
(pad "34" smd rect (at 8.89 -8.89) (size 3.5 1.7) (drill (offset 0.9 0)) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 0554bea0-89b2-4e25-9ea3-4c73921c94cb))
(pad "35" smd rect (at 8.89 -11.43) (size 3.5 1.7) (drill (offset 0.9 0)) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 88606262-3ac5-44a1-aacc-18b26cf4d396))
(pad "36" smd rect (at 8.89 -13.97) (size 3.5 1.7) (drill (offset 0.9 0)) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp cd1cff81-9d8a-4511-96d6-4ddb79484001))
(pad "37" smd rect (at 8.89 -16.51) (size 3.5 1.7) (drill (offset 0.9 0)) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 22962957-1efd-404d-83db-5b233b6c15b0))
(pad "38" smd rect (at 8.89 -19.05) (size 3.5 1.7) (drill (offset 0.9 0)) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 8eb98c56-17e4-4de6-a3e3-06dcfa392040))
(pad "39" smd rect (at 8.89 -21.59) (size 3.5 1.7) (drill (offset 0.9 0)) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp c66a19ed-90c0-4502-ae75-6a4c4ab9f297))
(pad "40" smd rect (at 8.89 -24.13) (size 3.5 1.7) (drill (offset 0.9 0)) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp bd085057-7c0e-463a-982b-968a2dc1f0f8))
(pad "41" smd rect (at -2.54 23.9 90) (size 3.5 1.7) (drill (offset -0.9 0)) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp b21299b9-3c4d-43df-b399-7f9b08eb5470))
(pad "42" smd rect (at 0 23.9 90) (size 3.5 1.7) (drill (offset -0.9 0)) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 751d823e-1d7b-4501-9658-d06d459b0e16))
(pad "43" smd rect (at 2.54 23.9 90) (size 3.5 1.7) (drill (offset -0.9 0)) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp aadc3df5-0e2d-4f3d-b72e-6f184da74c89))
(model "${KIPRJMOD}/../KiCad-RP Pico/RP-Pico-Libraries/Pico.wrl"
(offset (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)

516771
hw/boards/KiCad-RP Pico/RP-Pico-Libraries/Pico.wrl
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34
hw/boards/mta1-library/CERN_OHL_S_drawing_sheet.kicad_wks
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@ -1,34 +0,0 @@
(kicad_wks (version 20210606) (generator pl_editor)
(setup (textsize 1.5 1.5)(linewidth 0.15)(textlinewidth 0.15)
(left_margin 10)(right_margin 10)(top_margin 10)(bottom_margin 10))
(rect (name "") (start 110 60) (end 2 2) (comment "rect around the title block")
)
(rect (name "") (start 0 0 ltcorner) (end 0 0) (repeat 2) (incrx 2) (incry 2))
(line (name "") (start 50 2 ltcorner) (end 50 0 ltcorner) (repeat 30) (incrx 50))
(tbtext "1" (name "") (pos 25 1 ltcorner) (font (size 1.3 1.3)) (repeat 100) (incrx 50))
(line (name "") (start 50 2 lbcorner) (end 50 0 lbcorner) (repeat 30) (incrx 50))
(tbtext "1" (name "") (pos 25 1 lbcorner) (font (size 1.3 1.3)) (repeat 100) (incrx 50))
(line (name "") (start 0 50 ltcorner) (end 2 50 ltcorner) (repeat 30) (incry 50))
(tbtext "A" (name "") (pos 1 25 ltcorner) (font (size 1.3 1.3)) (justify center) (repeat 100) (incry 50))
(line (name "") (start 0 50 rtcorner) (end 2 50 rtcorner) (repeat 30) (incry 50))
(tbtext "A" (name "") (pos 1 25 rtcorner) (font (size 1.3 1.3)) (justify center) (repeat 100) (incry 50))
(tbtext "Date: ${ISSUE_DATE}" (name "") (pos 87 6.9))
(line (name "") (start 110 5.5) (end 2 5.5))
(tbtext "${KICAD_VERSION}" (name "") (pos 109 4.1) (comment "Kicad version")
)
(line (name "") (start 110 8.5) (end 2 8.5))
(tbtext "Rev: ${REVISION}" (name "") (pos 24 6.9) (font bold))
(tbtext "Size: ${PAPER}" (name "") (pos 109 6.9) (comment "Paper format name")
)
(tbtext "Id: ${#}/${##}" (name "") (pos 24 4.1) (comment "Sheet id")
)
(line (name "") (start 110 12.5) (end 2 12.5))
(tbtext "Title: ${TITLE}" (name "") (pos 109 10.7) (font (size 2 2) bold italic))
(tbtext "File: ${FILENAME}" (name "") (pos 109 14.3))
(line (name "") (start 110 18.5) (end 2 18.5))
(tbtext "Sheet: ${SHEETNAME}" (name "") (pos 109 17))
(line (name "") (start 90 8.5) (end 90 5.5))
(line (name "") (start 26 8.5) (end 26 2))
(tbtext "This document describes Open Hardware and is licensed under the CERN-OHL-S v2.\n\nYou may redistribute and modify this source and make products using it under\nthe terms of the CERN-OHL-S v2 (https://ohwr.org/cern_ohl_s_v2.txt).\n\nThis source is distributed WITHOUT ANY EXPRESS OR IMPLIED WARRANTY, INCLUDING\nOF MERCHANTABILITY, SATISFACTORY QUALITY AND FITNESS FOR A PARTICULAR PURPOSE.\nPlease see the CERN-OHL-S v2 for applicable conditions." (name "") (pos 107.729 33.0022))
(tbtext "Copyright ${COMPANY} ${COMMENT1}" (name "") (pos 107.729 53.3222) (font (size 2.5 2.5) bold))
)

113
hw/boards/mta1-library/bom_csv_grouped_by_extended_value.py
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@ -1,113 +0,0 @@
#
# Example python script to generate a BOM from a KiCad generic netlist
#
# Example: Sorted and Grouped CSV BOM
#
"""
@package
Output: CSV (comma-separated)
Grouped By: Value, Extended Value, Footprint
Sorted By: Ref
Fields: Ref, Qnty, Value, Footprint, Description, Manufacturer, Manufacturer Part Number
Command line:
python "pathToFile/bom_csv_grouped_by_extended_value.py" "%I" "%O.csv"
"""
# Import the KiCad python helper module and the csv formatter
import kicad_netlist_reader
import kicad_utils
import csv
import sys
# A helper function to convert a UTF8/Unicode/locale string read in netlist
# for python2 or python3
def fromNetlistText( aText ):
if sys.platform.startswith('win32'):
try:
return aText.encode('utf-8').decode('cp1252')
except UnicodeDecodeError:
return aText
else:
return aText
# Group components if their value, extended value, footprint, and reference designator type (?) are the same
import string
def equate_value_extended_value_footprint(self, other):
""" Equivalency operator, remember this can be easily overloaded
2 components are equivalent ( i.e. can be grouped
if they have same value and same footprint
Override the component equivalence operator must be done before
loading the netlist, otherwise all components will have the original
equivalency operator.
You have to define a comparison module (for instance named myEqu)
and add the line;
kicad_netlist_reader.comp.__eq__ = myEqu
in your bom generator script before calling the netliste reader by something like:
net = kicad_netlist_reader.netlist(sys.argv[1])
"""
result = False
if self.getValue() == other.getValue():
if self.getField("Extended Value") == other.getField("Extended Value"):
if self.getFootprint() == other.getFootprint():
if self.getRef().rstrip(string.digits) == other.getRef().rstrip(string.digits):
result = True
return result
kicad_netlist_reader.comp.__eq__ = equate_value_extended_value_footprint
# Generate an instance of a generic netlist, and load the netlist tree from
# the command line option. If the file doesn't exist, execution will stop
net = kicad_netlist_reader.netlist(sys.argv[1])
# Open a file to write to, if the file cannot be opened output to stdout
# instead
try:
f = kicad_utils.open_file_write(sys.argv[2], 'w')
except IOError:
e = "Can't open output file for writing: " + sys.argv[2]
print(__file__, ":", e, sys.stderr)
f = sys.stdout
# Create a new csv writer object to use as the output formatter
out = csv.writer(f, delimiter=',', lineterminator='\n', quotechar='\"', quoting=csv.QUOTE_ALL)
# Output a set of rows for a header providing general information
out.writerow(['Source:', net.getSource()])
out.writerow(['Date:', net.getDate()])
out.writerow(['Tool:', net.getTool()])
out.writerow( ['Generator:', sys.argv[0]] )
out.writerow(['Component Count:', len(net.components)])
out.writerow(['Ref', 'Qnty', 'Value', 'Footprint', 'Description', 'Manufacturer', 'Manufacturer Part Number', 'Supplier', 'Supplier Part Number'])
# Get all of the components in groups of matching parts + values
# (see ky_generic_netlist_reader.py)
grouped = net.groupComponents()
# Output all of the component information
for group in grouped:
refs = ','.join([fromNetlistText( component.getRef() ) for component in group])
c = group[-1]
combinedvalue = c.getValue()
if c.getField("Extended Value") != '':
combinedvalue += ',' + c.getField("Extended Value")
# Fill in the component groups common data
out.writerow([
refs,
len(group),
combinedvalue,
fromNetlistText( c.getFootprint() ),
fromNetlistText( c.getDescription() ),
fromNetlistText( c.getField("Manufacturer") ),
fromNetlistText( c.getField("Manufacturer Part Number") ),
fromNetlistText( c.getField("Supplier") ),
fromNetlistText( c.getField("Supplier Part Number") )
])

15
hw/boards/mta1-library/mta1.dcm
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@ -1,15 +0,0 @@
EESchema-DOCLIB Version 2.0
#
$CMP ICE40UP5K-SG48ITR
D iCE40 UltraPlus FPGA, 5280 LUTs, 1.2V, 48-pin QFN
K FPGA programmable logic
F http://www.latticesemi.com/Products/FPGAandCPLD/iCE40Ultra
$ENDCMP
#
$CMP W25Q80DVSNIG
D 32Mb Serial Flash Memory, Standard/Dual/Quad SPI, SOIC-8
K flash memory SPI
F https://www.winbond.com/resource-files/w25q80dv_revg_07212015.pdf
$ENDCMP
#
#End Doc Library

1863
hw/boards/mta1-library/mta1.kicad_sym
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61
hw/boards/mta1-library/mta1.pretty/0402rgb-1010.kicad_mod
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@ -1,61 +0,0 @@
(footprint "0402rgb-1010" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 616EE650)
(attr smd)
(fp_text reference "D" (at 0 0) (layer "F.Fab")
(effects (font (size 0.5 0.5) (thickness 0.075)))
(tstamp 6eaf44a5-2bb8-4e84-ae85-e082a57042dd)
)
(fp_text value "0402rgb-1010" (at 0.0635 -1.54178) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 4e647fa9-4baf-493a-891e-373b7bb90db1)
)
(fp_poly (pts
(xy -0.6096 -0.60198)
(xy -0.29972 -0.60198)
(xy -0.29972 -0.25146)
(xy -0.6096 -0.25146)
(xy -0.6096 -0.45212)
) (layer "F.Paste") (width 0.01) (fill solid) (tstamp 8cd8d6bd-0601-49fc-9009-a437af9b27c1))
(fp_poly (pts
(xy 0.2921 0.25146)
(xy 0.60198 0.25146)
(xy 0.60198 0.60198)
(xy 0.2921 0.60198)
(xy 0.2921 0.40132)
) (layer "F.Paste") (width 0.01) (fill solid) (tstamp c0eb397c-0f0a-48f2-a4a7-a39c38857565))
(fp_poly (pts
(xy 0.28956 -0.60198)
(xy 0.59944 -0.60198)
(xy 0.59944 -0.25146)
(xy 0.28956 -0.25146)
(xy 0.28956 -0.45212)
) (layer "F.Paste") (width 0.01) (fill solid) (tstamp f157df02-fcb0-4ae7-85ca-bfc4444eda90))
(fp_poly (pts
(xy -0.60198 0.24892)
(xy -0.2921 0.24892)
(xy -0.2921 0.59944)
(xy -0.60198 0.59944)
(xy -0.60198 0.39878)
) (layer "F.Paste") (width 0.01) (fill solid) (tstamp f3dab665-64fc-433e-8a62-3743b891ab83))
(fp_line (start 0.6477 0.4191) (end 0.6477 0.65278) (layer "F.SilkS") (width 0.05) (tstamp 4ea989fb-9cda-4210-89d1-fe153727e40c))
(fp_line (start 0.6477 0.65278) (end 0.44704 0.65278) (layer "F.SilkS") (width 0.05) (tstamp f64aa569-ea55-4736-9c96-3bfc2b30ccbd))
(fp_line (start -0.8 -0.8) (end 0.8 -0.8) (layer "F.CrtYd") (width 0.05) (tstamp 05e65b06-4a6d-49f9-a6e8-c5bc53ef3e2a))
(fp_line (start -0.8 0.8) (end 0.8 0.8) (layer "F.CrtYd") (width 0.05) (tstamp 39156b1c-bf91-438d-afb8-2007458c0b8e))
(fp_line (start 0.8 0.8) (end 0.8 -0.8) (layer "F.CrtYd") (width 0.05) (tstamp 914c5b3a-21b5-462d-8f55-ca0b3cc81d2e))
(fp_line (start -0.8 0.8) (end -0.8 -0.8) (layer "F.CrtYd") (width 0.05) (tstamp dd287ecc-48c7-4569-84ef-5639ce72358e))
(fp_line (start -0.6 0.6) (end -0.6 -0.6) (layer "F.Fab") (width 0.1) (tstamp 08f7614b-9649-49c1-b63a-65c3d0a1ef41))
(fp_line (start 0.3 0.6) (end -0.6 0.6) (layer "F.Fab") (width 0.1) (tstamp 27c16a37-d65b-4a83-af1a-5ee1a87062f4))
(fp_line (start 0.3 0.6) (end 0.6 0.3) (layer "F.Fab") (width 0.1) (tstamp 4b62363e-5fde-40c0-ad96-ceb955d367f5))
(fp_line (start 0.6 -0.6) (end 0.6 0.3) (layer "F.Fab") (width 0.1) (tstamp 77068506-5e69-47f6-8c18-559ed07a8a9f))
(fp_line (start -0.6 -0.6) (end 0.6 -0.6) (layer "F.Fab") (width 0.1) (tstamp 9d536585-2f1d-4551-af3b-a0a4a6fa8aee))
(pad "1" smd rect (at 0.38 0.38) (size 0.45 0.45) (layers "F.Cu" "F.Mask") (tstamp 1d4ec9d6-b4f1-4935-a655-c469bc01feb9))
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#482=UNCERTAINTY_MEASURE_WITH_UNIT(LENGTH_MEASURE(0.01),#486,
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GEOMETRIC_REPRESENTATION_CONTEXT(3)
GLOBAL_UNCERTAINTY_ASSIGNED_CONTEXT((#482))
GLOBAL_UNIT_ASSIGNED_CONTEXT((#486,#488,#489))
REPRESENTATION_CONTEXT('','3D')
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#485=(
GEOMETRIC_REPRESENTATION_CONTEXT(3)
GLOBAL_UNCERTAINTY_ASSIGNED_CONTEXT((#483))
GLOBAL_UNIT_ASSIGNED_CONTEXT((#486,#488,#489))
REPRESENTATION_CONTEXT('','3D')
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#486=(
LENGTH_UNIT()
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SI_UNIT(.MILLI.,.METRE.)
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LENGTH_UNIT()
NAMED_UNIT(*)
SI_UNIT($,.METRE.)
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PLANE_ANGLE_UNIT()
SI_UNIT($,.RADIAN.)
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SI_UNIT($,.STERADIAN.)
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#496=PRODUCT_RELATED_PRODUCT_CATEGORY('Ferriit bead v1',
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#498=APPLICATION_CONTEXT(
'Core Data for Automotive Mechanical Design Process');
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#504=SURFACE_STYLE_USAGE(.BOTH.,#507);
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#513=FILL_AREA_STYLE('Steel - Satin',(#516));
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ENDSEC;
END-ISO-10303-21;

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hw/boards/mta1-library/mta1.pretty/3d_models/ICE40UP5K-SG48ITR.step
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hw/boards/mta1-library/mta1.pretty/3d_models/MC2016Z.step
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hw/boards/mta1-library/mta1.pretty/3d_models/MCP1824T.step
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hw/boards/mta1-library/mta1.pretty/3d_models/U261-241N-4BS60.step
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hw/boards/mta1-library/mta1.pretty/3d_models/USON_2X3.step
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hw/boards/mta1-library/mta1.pretty/3d_models/molex_1054440001.stp
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hw/boards/mta1-library/mta1.pretty/3d_models/mta1_usb_ch554_pogo.step
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hw/boards/mta1-library/mta1.pretty/3d_models/u261-24xn-4bs60.stp
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hw/boards/mta1-library/mta1.pretty/AP22802AW5-SOT-23-5.kicad_mod
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@ -1,40 +0,0 @@
(footprint "AP22802AW5-SOT-23-5" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 61367F51)
(descr "5-pin SOT23 package")
(tags "SOT-23-5")
(attr smd)
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(tstamp 2592a4a3-bdaa-4fb0-9abb-8c21c03c0638)
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(effects (font (size 1 1) (thickness 0.15)))
(tstamp 03a09cf1-7d57-4196-9c02-dff2303bf34f)
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(fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
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(tstamp 7cb260b0-5651-4e66-90db-eaf84bb25ba9)
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(model "${KIPRJMOD}/../mta1-library/mta1.pretty/3d_models/AP22802AW5-SOT23-5-MARKS XA7sE.step"
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(rotate (xyz -90 0 -90))
)
)

35
hw/boards/mta1-library/mta1.pretty/BC-1-208.kicad_mod
View File

@ -1,35 +0,0 @@
(footprint "BC-1-208" (version 20211014) (generator pcbnew)
(layer "F.Cu")
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(attr smd)
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(tstamp e6235600-87cc-4c82-b15f-34fb66b9bf0e)
)
(fp_text user "${REFERENCE}" (at 0 0 unlocked) (layer "F.Fab")
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(tstamp e73ef891-c9f9-42ab-894b-b2580ee0b0a1)
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(pad "2" smd roundrect (at 2 1) (size 2.6 1.7) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.1) (tstamp e60f5c1d-c97e-4327-8023-b78c1d20bdfb))
(model "../mta1-library/mta1.pretty/3d_models/BC-1-208.step"
(offset (xyz 0 5 0))
(scale (xyz 1 1 1))
(rotate (xyz -90 0 -90))
)
)

40
hw/boards/mta1-library/mta1.pretty/BC-1-701.kicad_mod
View File

@ -1,40 +0,0 @@
(footprint "BC-1-701" (version 20211014) (generator pcbnew)
(layer "F.Cu")
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(effects (font (size 1 1) (thickness 0.15)))
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(tstamp e6235600-87cc-4c82-b15f-34fb66b9bf0e)
)
(fp_text user "${REFERENCE}" (at 0 0 unlocked) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp e73ef891-c9f9-42ab-894b-b2580ee0b0a1)
)
(fp_line (start -3 7) (end -3 -7) (layer "F.SilkS") (width 0.12) (tstamp 36915340-9dd2-4d10-bb2e-946e32cc121b))
(fp_line (start 3 7) (end -3 7) (layer "F.SilkS") (width 0.12) (tstamp a82cec30-45c1-49b3-b9e6-e30cc49eb759))
(fp_line (start -3 -7) (end 3 -7) (layer "F.SilkS") (width 0.12) (tstamp d789eb5c-7750-4e88-bd51-088f1d8d4899))
(fp_line (start -3.5 7.5) (end 3.5 7.5) (layer "F.CrtYd") (width 0.05) (tstamp 0f5e332d-aeaa-4ead-958c-993a39728c19))
(fp_line (start -3.5 7.5) (end -3.5 -7.5) (layer "F.CrtYd") (width 0.05) (tstamp 135e3642-358a-4af8-829a-e9d8d5db6f15))
(fp_line (start -3.5 -7.5) (end 3.5 -7.5) (layer "F.CrtYd") (width 0.05) (tstamp 88f2c5d0-ef3f-49a8-aa6f-586a595bc1a1))
(fp_line (start 3.5 7.5) (end 3.5 -7.5) (layer "F.CrtYd") (width 0.05) (tstamp f1b1c833-6823-43af-b40b-5bbeb1279d5f))
(fp_line (start 3 7) (end 3 -7) (layer "F.Fab") (width 0.12) (tstamp 11d2d201-bc39-4860-b7b8-2ea43340be97))
(fp_line (start -3 7) (end -3 -7) (layer "F.Fab") (width 0.12) (tstamp 19a5b698-5dc9-4ea2-9d80-f7f9cbd292c9))
(fp_line (start -3 7) (end 3 7) (layer "F.Fab") (width 0.12) (tstamp 3e39adc1-9b06-431d-9446-ca8e37f3ccd9))
(fp_line (start -3 -7) (end 3 -7) (layer "F.Fab") (width 0.12) (tstamp 9ed29860-ed5a-408f-8820-1ab6b7a9a7c3))
(pad "1" smd roundrect (at 2 -6) (size 2.6 1.7) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.1) (tstamp e0795232-a4f5-40af-bd8a-4a69f1a39aa6))
(pad "2" smd roundrect (at 2 -4) (size 2.6 1.7) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.1) (tstamp e60f5c1d-c97e-4327-8023-b78c1d20bdfb))
(pad "3" smd roundrect (at 2 -2) (size 2.6 1.7) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.1) (tstamp 6dead470-a003-4d9a-a776-ac69dd42634c))
(pad "4" smd roundrect (at 2 0) (size 2.6 1.7) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.1) (tstamp 691faf73-5aa1-4ed9-9a31-9b56032bfa62))
(pad "5" smd roundrect (at 2 2) (size 2.6 1.7) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.1) (tstamp 54a3c92d-a091-405f-b445-603c0f2e1fb3))
(pad "6" smd roundrect (at 2 4) (size 2.6 1.7) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.1) (tstamp 02a08a24-751b-4ad4-b6b1-621603af88cc))
(pad "7" smd roundrect (at 2 6) (size 2.6 1.7) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.1) (tstamp 5d68a8ff-55d9-4830-83f9-f4b7757ac472))
(model "../mta1-library/mta1.pretty/3d_models/BC-1-701.step"
(offset (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz -90 0 -90))
)
)

31
hw/boards/mta1-library/mta1.pretty/CAPC1005X06L.kicad_mod
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@ -1,31 +0,0 @@
(module CAPC1005X06L (layer F.Cu) (tedit 6137303B)
(descr "Capacitor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 least")
(tags capacitor)
(attr smd)
(fp_text reference REF** (at 0 -1.16) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value CAPC1005X06L (at 0 1.16) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start 0.91 0.46) (end -0.91 0.46) (layer F.CrtYd) (width 0.05))
(fp_line (start 0.91 -0.46) (end 0.91 0.46) (layer F.CrtYd) (width 0.05))
(fp_line (start -0.91 -0.46) (end 0.91 -0.46) (layer F.CrtYd) (width 0.05))
(fp_line (start -0.91 0.46) (end -0.91 -0.46) (layer F.CrtYd) (width 0.05))
(fp_line (start -0.107836 0.36) (end 0.107836 0.36) (layer F.SilkS) (width 0.12))
(fp_line (start -0.107836 -0.36) (end 0.107836 -0.36) (layer F.SilkS) (width 0.12))
(fp_line (start 0.5 0.25) (end -0.5 0.25) (layer F.Fab) (width 0.1))
(fp_line (start 0.5 -0.25) (end 0.5 0.25) (layer F.Fab) (width 0.1))
(fp_line (start -0.5 -0.25) (end 0.5 -0.25) (layer F.Fab) (width 0.1))
(fp_line (start -0.5 0.25) (end -0.5 -0.25) (layer F.Fab) (width 0.1))
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 0.25 0.25) (thickness 0.04)))
)
(pad 1 smd roundrect (at -0.39 0) (size 0.56 0.518) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 2 smd roundrect (at 0.39 0) (size 0.56 0.518) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(model ${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0402_1005Metric.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)

31
hw/boards/mta1-library/mta1.pretty/CAPC1608X09L.kicad_mod
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@ -1,31 +0,0 @@
(module CAPC1608X09L (layer F.Cu) (tedit 61373115)
(descr "Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 least")
(tags capacitor)
(attr smd)
(fp_text reference REF** (at 0 -1.43) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value CAPC1608X09L (at 0 1.43) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer F.Fab) (width 0.1))
(fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1))
(fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer F.Fab) (width 0.1))
(fp_line (start 0.8 0.4) (end -0.8 0.4) (layer F.Fab) (width 0.1))
(fp_line (start -0.14058 -0.51) (end 0.14058 -0.51) (layer F.SilkS) (width 0.12))
(fp_line (start -0.14058 0.51) (end 0.14058 0.51) (layer F.SilkS) (width 0.12))
(fp_line (start -1.48 0.73) (end -1.48 -0.73) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.48 -0.73) (end 1.48 -0.73) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.48 -0.73) (end 1.48 0.73) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.48 0.73) (end -1.48 0.73) (layer F.CrtYd) (width 0.05))
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 0.4 0.4) (thickness 0.06)))
)
(pad 1 smd roundrect (at -0.65 0) (size 0.8 0.85) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 2 smd roundrect (at 0.65 0) (size 0.8 0.85) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(model ${KICAD6_3DMODEL_DIR}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)

31
hw/boards/mta1-library/mta1.pretty/ERJ2G(0402)_L.kicad_mod
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@ -1,31 +0,0 @@
(module "ERJ2G(0402)_L" (layer F.Cu) (tedit 6137302D)
(descr "Resistor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 least")
(tags resistor)
(attr smd)
(fp_text reference REF** (at 0 -1.17) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value "ERJ2G(0402)_L" (at 0 1.17) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -0.525 0.27) (end -0.525 -0.27) (layer F.Fab) (width 0.1))
(fp_line (start -0.525 -0.27) (end 0.525 -0.27) (layer F.Fab) (width 0.1))
(fp_line (start 0.525 -0.27) (end 0.525 0.27) (layer F.Fab) (width 0.1))
(fp_line (start 0.525 0.27) (end -0.525 0.27) (layer F.Fab) (width 0.1))
(fp_line (start -0.153641 -0.38) (end 0.153641 -0.38) (layer F.SilkS) (width 0.12))
(fp_line (start -0.153641 0.38) (end 0.153641 0.38) (layer F.SilkS) (width 0.12))
(fp_line (start -0.93 0.47) (end -0.93 -0.47) (layer F.CrtYd) (width 0.05))
(fp_line (start -0.93 -0.47) (end 0.93 -0.47) (layer F.CrtYd) (width 0.05))
(fp_line (start 0.93 -0.47) (end 0.93 0.47) (layer F.CrtYd) (width 0.05))
(fp_line (start 0.93 0.47) (end -0.93 0.47) (layer F.CrtYd) (width 0.05))
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 0.26 0.26) (thickness 0.04)))
)
(pad 1 smd roundrect (at -0.4 0) (size 0.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 2 smd roundrect (at 0.4 0) (size 0.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(model ${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0402_1005Metric.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)

72
hw/boards/mta1-library/mta1.pretty/FT2232H_MINI_MODULE.kicad_mod
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@ -1,72 +0,0 @@
(module FT2232H_MINI_MODULE (layer F.Cu) (tedit 616F3922)
(fp_text reference REF** (at 0 0.5) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value FT2232H_MINI_MODULE (at 0 -2.54) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -14.605 34.29) (end -14.605 -1.27) (layer F.Fab) (width 0.12))
(fp_line (start 14.605 34.29) (end -14.605 34.29) (layer F.Fab) (width 0.12))
(fp_line (start 14.605 -1.27) (end 14.605 34.29) (layer F.Fab) (width 0.12))
(fp_line (start -14.605 -1.27) (end 14.605 -1.27) (layer F.Fab) (width 0.12))
(fp_line (start -13.97 34.29) (end -13.97 1.27) (layer F.CrtYd) (width 0.12))
(fp_line (start -8.89 34.29) (end -13.97 34.29) (layer F.CrtYd) (width 0.12))
(fp_line (start -8.89 1.27) (end -8.89 34.29) (layer F.CrtYd) (width 0.12))
(fp_line (start -13.97 1.27) (end -8.89 1.27) (layer F.CrtYd) (width 0.12))
(fp_line (start 8.89 34.29) (end 8.89 1.27) (layer F.CrtYd) (width 0.12))
(fp_line (start 13.97 34.29) (end 8.89 34.29) (layer F.CrtYd) (width 0.12))
(fp_line (start 13.97 1.27) (end 13.97 34.29) (layer F.CrtYd) (width 0.12))
(fp_line (start 8.89 1.27) (end 13.97 1.27) (layer F.CrtYd) (width 0.12))
(pad 2.3 thru_hole circle (at -12.7 5.08) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 2.4 thru_hole circle (at -10.16 5.08) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 2.5 thru_hole circle (at -12.7 7.62) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 2.6 thru_hole circle (at -10.16 7.62) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 2.7 thru_hole circle (at -12.7 10.16) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 2.8 thru_hole circle (at -10.16 10.16) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 2.9 thru_hole circle (at -12.7 12.7) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 2.10 thru_hole circle (at -10.16 12.7) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 2.11 thru_hole circle (at -12.7 15.24) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 2.12 thru_hole circle (at -10.16 15.24) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 2.13 thru_hole circle (at -12.7 17.78) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 2.14 thru_hole circle (at -10.16 17.78) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 2.15 thru_hole circle (at -12.7 20.32) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 2.16 thru_hole circle (at -10.16 20.32) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 2.17 thru_hole circle (at -12.7 22.86) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 2.18 thru_hole circle (at -10.16 22.86) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 2.19 thru_hole circle (at -12.7 25.4) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 2.20 thru_hole circle (at -10.16 25.4) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 2.21 thru_hole circle (at -12.7 27.94) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 2.22 thru_hole circle (at -10.16 27.94) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 2.23 thru_hole circle (at -12.7 30.48) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 2.24 thru_hole circle (at -10.16 30.48) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 2.25 thru_hole circle (at -12.7 33.02) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 2.26 thru_hole circle (at -10.16 33.02) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 3.1 thru_hole rect (at 10.16 2.54) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 3.2 thru_hole circle (at 12.7 2.54) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 3.3 thru_hole circle (at 10.16 5.08) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 3.4 thru_hole circle (at 12.7 5.08) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 3.5 thru_hole circle (at 10.16 7.62) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 3.6 thru_hole circle (at 12.7 7.62) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 3.7 thru_hole circle (at 10.16 10.16) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 3.8 thru_hole circle (at 12.7 10.16) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 3.9 thru_hole circle (at 10.16 12.7) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 3.10 thru_hole circle (at 12.7 12.7) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 3.11 thru_hole circle (at 10.16 15.24) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 3.12 thru_hole circle (at 12.7 15.24) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 3.13 thru_hole circle (at 10.16 17.78) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 3.14 thru_hole circle (at 12.7 17.78) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 3.15 thru_hole circle (at 10.16 20.32) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 3.16 thru_hole circle (at 12.7 20.32) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 3.17 thru_hole circle (at 10.16 22.86) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 3.18 thru_hole circle (at 12.7 22.86) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 3.19 thru_hole circle (at 10.16 25.4) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 3.20 thru_hole circle (at 12.7 25.4) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 3.21 thru_hole circle (at 10.16 27.94) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 3.22 thru_hole circle (at 12.7 27.94) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 3.23 thru_hole circle (at 10.16 30.48) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 3.24 thru_hole circle (at 12.7 30.48) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 3.25 thru_hole circle (at 10.16 33.02) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 3.26 thru_hole circle (at 12.7 33.02) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 2.1 thru_hole rect (at -12.7 2.54) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
(pad 2.2 thru_hole circle (at -10.16 2.54) (size 1.524 1.524) (drill 0.762) (layers *.Cu *.Mask))
)

36
hw/boards/mta1-library/mta1.pretty/Ferritbead_0603_1608Metric.kicad_mod
View File

@ -1,36 +0,0 @@
(footprint "Ferritbead_0603_1608Metric" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 61367F9E)
(descr "Resistor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
(tags "resistor")
(attr smd)
(fp_text reference "REF**" (at 0 -1.43) (layer "F.SilkS")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 1ce2ffb7-ffc4-4e47-b214-2d2cac3c163f)
)
(fp_text value "Ferritbead_0603_1608Metric" (at -0.04 1.77) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 1aa798ef-05b4-4b6b-8a42-14d04b18e64b)
)
(fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
(effects (font (size 0.4 0.4) (thickness 0.06)))
(tstamp 786859eb-3872-47d1-b0a8-5c8bf5b59caa)
)
(fp_line (start -0.237258 -0.5225) (end 0.237258 -0.5225) (layer "F.SilkS") (width 0.12) (tstamp 70af1960-c7b2-47e7-bb4f-fabc79c69252))
(fp_line (start -0.237258 0.5225) (end 0.237258 0.5225) (layer "F.SilkS") (width 0.12) (tstamp ff4b255d-3f6d-4a63-a192-65268a0eae13))
(fp_line (start 1.48 -0.73) (end 1.48 0.73) (layer "F.CrtYd") (width 0.05) (tstamp 2a01c873-f57d-492e-bf25-58fe94e9d1e0))
(fp_line (start -1.48 0.73) (end -1.48 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp 5433ec0a-0a00-47bb-aad6-1c489b00e5eb))
(fp_line (start -1.48 -0.73) (end 1.48 -0.73) (layer "F.CrtYd") (width 0.05) (tstamp b4839cf7-915f-4c3a-9fec-7fedef1a70be))
(fp_line (start 1.48 0.73) (end -1.48 0.73) (layer "F.CrtYd") (width 0.05) (tstamp e9c83f62-8e46-4552-976d-19d79f6a16bc))
(fp_line (start -0.8 -0.4125) (end 0.8 -0.4125) (layer "F.Fab") (width 0.1) (tstamp 6ee555d4-685b-4a36-a65d-b23477664fb4))
(fp_line (start 0.8 -0.4125) (end 0.8 0.4125) (layer "F.Fab") (width 0.1) (tstamp a7708b89-613f-4f36-b3fc-95f809398e8c))
(fp_line (start 0.8 0.4125) (end -0.8 0.4125) (layer "F.Fab") (width 0.1) (tstamp aa16870e-ed3b-4d28-b416-757f77673a2e))
(fp_line (start -0.8 0.4125) (end -0.8 -0.4125) (layer "F.Fab") (width 0.1) (tstamp af57c83d-df74-4689-9e5f-264d28357c24))
(pad "1" smd roundrect (at -0.825 0) (size 0.8 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 1e17f6de-84b5-47ae-a626-24dc38f0554e))
(pad "2" smd roundrect (at 0.825 0) (size 0.8 0.95) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp d5a5a7f5-3c80-45cd-a86a-2699afb1d2f6))
(model "${KIPRJMOD}/../mta1-library/mta1.pretty/3d_models/Ferriit bead-0603.step"
(offset (xyz 0 -0.25 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)

115
hw/boards/mta1-library/mta1.pretty/ICE40UP5K-SG48ITRQFN-48QFN.kicad_mod
View File

@ -1,115 +0,0 @@
(footprint "ICE40UP5K-SG48ITRQFN-48QFN" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 616F37D0)
(descr "QFN, 48 Pin (http://www.st.com/resource/en/datasheet/stm32f042k6.pdf#page=94), generated with kicad-footprint-generator ipc_noLead_generator.py")
(tags "QFN NoLead")
(attr smd)
(fp_text reference "REF**" (at 0 -4.82) (layer "F.SilkS")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 612d3026-9be4-47d3-9f7e-79566d651b8c)
)
(fp_text value "ICE40UP5K-SG48ITRQFN-48" (at 0 4.82) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 233fb020-8d0e-4587-b6fd-49863319a31c)
)
(fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 9abe78e8-cd02-4892-b378-4098c4083479)
)
(fp_line (start 3.135 3.61) (end 3.61 3.61) (layer "F.SilkS") (width 0.12) (tstamp 1c154bd3-21fe-4ae7-9d38-138df617c625))
(fp_line (start 3.135 -3.61) (end 3.61 -3.61) (layer "F.SilkS") (width 0.12) (tstamp 48022127-c694-4340-80a6-60b3d5340af7))
(fp_line (start -3.135 -3.61) (end -3.61 -3.61) (layer "F.SilkS") (width 0.12) (tstamp 5a2e5d6a-fae6-4cda-b43c-f03b0ac47412))
(fp_line (start -3.61 3.61) (end -3.61 3.135) (layer "F.SilkS") (width 0.12) (tstamp aeb3689a-92ec-4bc5-a749-8a78707ae63e))
(fp_line (start 3.61 -3.61) (end 3.61 -3.135) (layer "F.SilkS") (width 0.12) (tstamp b0b97b4a-9cdf-4481-bf30-f78edaf9300a))
(fp_line (start -3.135 3.61) (end -3.61 3.61) (layer "F.SilkS") (width 0.12) (tstamp d2140b97-3ed8-4348-b277-02841d1baecc))
(fp_line (start 3.61 3.61) (end 3.61 3.135) (layer "F.SilkS") (width 0.12) (tstamp de5d727c-8e49-454f-97e0-39a6212ad06f))
(fp_line (start 4.12 -4.12) (end -4.12 -4.12) (layer "F.CrtYd") (width 0.05) (tstamp 1faea7e2-782e-4cbb-87d8-851452b8a697))
(fp_line (start -4.12 4.12) (end 4.12 4.12) (layer "F.CrtYd") (width 0.05) (tstamp 31a2fde1-c811-4054-b9e9-dd278be046a1))
(fp_line (start -4.12 -4.12) (end -4.12 4.12) (layer "F.CrtYd") (width 0.05) (tstamp 5e72aa8b-ac6e-4319-9271-0e62fed8055b))
(fp_line (start 4.12 4.12) (end 4.12 -4.12) (layer "F.CrtYd") (width 0.05) (tstamp 975354fe-8c32-44ac-8139-97f01f3c2fb9))
(fp_line (start 3.5 3.5) (end -3.5 3.5) (layer "F.Fab") (width 0.1) (tstamp 0c7c6a1c-0b48-4b90-91eb-5d85c02062bd))
(fp_line (start -3.5 3.5) (end -3.5 -2.5) (layer "F.Fab") (width 0.1) (tstamp 36d15b3a-8621-45c5-a111-a43531896fb1))
(fp_line (start 3.5 -3.5) (end 3.5 3.5) (layer "F.Fab") (width 0.1) (tstamp 4e2cbe99-69bc-452b-a8b5-bcd716ef8994))
(fp_line (start -3.5 -2.5) (end -2.5 -3.5) (layer "F.Fab") (width 0.1) (tstamp 73ed5572-4501-4247-9671-397eeb753d88))
(fp_line (start -2.5 -3.5) (end 3.5 -3.5) (layer "F.Fab") (width 0.1) (tstamp de2f46c5-bacc-4864-90c6-f6cf715b693b))
(pad "" smd roundrect (at -2.1 2.1) (size 1.13 1.13) (layers "F.Paste") (roundrect_rratio 0.221239) (tstamp 111acb24-8fc7-4335-afac-cdae01c8fa5b))
(pad "" smd roundrect (at -0.7 2.1) (size 1.13 1.13) (layers "F.Paste") (roundrect_rratio 0.221239) (tstamp 15c61562-3b50-4729-9e30-a2d51ba08c48))
(pad "" smd roundrect (at 2.1 2.1) (size 1.13 1.13) (layers "F.Paste") (roundrect_rratio 0.221239) (tstamp 1610f979-9f30-4701-908f-2ab18ff38c4e))
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(pad "" smd roundrect (at -2.1 -2.1) (size 1.13 1.13) (layers "F.Paste") (roundrect_rratio 0.221239) (tstamp c3ca7fe3-4be1-4f1c-8523-bedfd0a320a6))
(pad "" smd roundrect (at 0.7 2.1) (size 1.13 1.13) (layers "F.Paste") (roundrect_rratio 0.221239) (tstamp d37fb919-08c3-49ff-a49f-5698cc7b15c9))
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(pad "" smd roundrect (at 2.1 -2.1) (size 1.13 1.13) (layers "F.Paste") (roundrect_rratio 0.221239) (tstamp de096609-eeb1-49f2-81b5-d9da9f7246bf))
(pad "" smd roundrect (at 2.1 0.7) (size 1.13 1.13) (layers "F.Paste") (roundrect_rratio 0.221239) (tstamp e01533bb-8c98-437b-a0c8-4bd8f3319120))
(pad "" smd roundrect (at 0.7 -2.1) (size 1.13 1.13) (layers "F.Paste") (roundrect_rratio 0.221239) (tstamp f8e19c9f-b06a-40a9-801e-f0c9c9eab231))
(pad "" smd roundrect (at 2.1 -0.7) (size 1.13 1.13) (layers "F.Paste") (roundrect_rratio 0.221239) (tstamp fbd779dd-6c19-405f-bf84-2db8decaac68))
(pad "1" smd roundrect (at -3.4375 -2.75) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 47f2cf27-9943-4644-a23d-bf57dcef64e4))
(pad "2" smd roundrect (at -3.4375 -2.25) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 538be93e-9d02-4c44-b797-27b4d4e0a3b0))
(pad "3" smd roundrect (at -3.4375 -1.75) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 39fb6573-307d-4b18-b800-eebc0cb49538))
(pad "4" smd roundrect (at -3.4375 -1.25) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp e561dfa8-0b32-4cb2-b7dc-7df974b52e9e))
(pad "5" smd roundrect (at -3.4375 -0.75) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 27020de1-e7d9-4caf-8f64-8ca0900a9c53))
(pad "6" smd roundrect (at -3.4375 -0.25) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 60abf821-b8ae-456a-9946-e8456d2d2228))
(pad "7" smd roundrect (at -3.4375 0.25) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 81fe3798-d664-412c-8752-f07fa912e9f1))
(pad "8" smd roundrect (at -3.4375 0.75) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp fc52d54d-1c86-4529-b159-0ef074b57360))
(pad "9" smd roundrect (at -3.4375 1.25) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp ca5ed947-9774-488a-bf67-43369f1f3b56))
(pad "10" smd roundrect (at -3.4375 1.75) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp d8edbcae-64fa-4843-9ed4-ebc6f4001489))
(pad "11" smd roundrect (at -3.4375 2.25) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 164c910d-4aab-476a-82b4-327fb3aec257))
(pad "12" smd roundrect (at -3.4375 2.75) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp d262079b-9105-4efa-b3eb-12df6c97a0b7))
(pad "13" smd roundrect (at -2.75 3.4375) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp edb5da08-7c04-4ad4-9a40-5201f7bdf31c))
(pad "14" smd roundrect (at -2.25 3.4375) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp bee823cd-6d90-4ff8-b111-cfb18110db66))
(pad "15" smd roundrect (at -1.75 3.4375) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 6745996f-203e-41ea-951c-b7abd96f894d))
(pad "16" smd roundrect (at -1.25 3.4375) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 4cb91b14-51da-4655-9a84-7a0b0e03242f))
(pad "17" smd roundrect (at -0.75 3.4375) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp a9afa0b4-07b7-4da0-bcaf-8e02d831b979))
(pad "18" smd roundrect (at -0.25 3.4375) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp ba61efbe-c0c7-49c0-8e76-a656312b40c6))
(pad "19" smd roundrect (at 0.25 3.4375) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp d2143b61-ca12-480b-ad56-9f7a5c4cfe87))
(pad "20" smd roundrect (at 0.75 3.4375) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp a7dee156-9cb7-4378-88c2-445b299bdb4b))
(pad "21" smd roundrect (at 1.25 3.4375) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp c83ec62d-7104-433d-a64a-6e3c06fa8f02))
(pad "22" smd roundrect (at 1.75 3.4375) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp d2f6c0ae-93ea-490c-a0d3-bb3c10f0310e))
(pad "23" smd roundrect (at 2.25 3.4375) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp f482f350-a5ad-43b8-9ec2-07fb6ee67689))
(pad "24" smd roundrect (at 2.75 3.4375) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 60ecae3f-2c75-4c7e-9e18-f686bb3a2db6))
(pad "25" smd roundrect (at 3.4375 2.75) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp afa8d13b-8daf-42a0-af71-47acad988704))
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(pad "27" smd roundrect (at 3.4375 1.75) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp d6b18d30-d5e9-4a1f-af52-e5a616b08474))
(pad "28" smd roundrect (at 3.4375 1.25) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 7a86f46c-3bc1-4456-8bf7-12cfd5924db3))
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(pad "32" smd roundrect (at 3.4375 -0.75) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp b987f42a-6a83-4674-9036-886e9a714c50))
(pad "33" smd roundrect (at 3.4375 -1.25) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 0cb8ea63-c770-4231-9d50-f32c9e8d05b8))
(pad "34" smd roundrect (at 3.4375 -1.75) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 44ed9385-2164-48d7-bb89-8d1ead808a7f))
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(pad "45" smd roundrect (at -1.25 -3.4375) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 96de58ae-bd0c-4729-bcaa-2c880345f3be))
(pad "46" smd roundrect (at -1.75 -3.4375) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp dc2ab6b2-cd86-4474-b773-229cca8c149d))
(pad "47" smd roundrect (at -2.25 -3.4375) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp db934191-c8cd-46af-9c49-bfde6495955e))
(pad "48" smd roundrect (at -2.75 -3.4375) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 5412c2c5-a98d-4490-b76b-96cd21ed9b30))
(pad "49" smd rect (at 0 0) (size 5.5 5.5) (layers "F.Cu" "F.Mask") (tstamp 1ce64a03-ad4d-44d3-ac8c-71661f3f2b1f))
(pad "49" thru_hole circle (at 1.524 -1.524 270) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
(solder_mask_margin -0.299) (zone_connect 2) (tstamp 2ae1c526-ad04-407b-ab02-84fa363edb82))
(pad "49" thru_hole circle (at 0 0 270) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
(solder_mask_margin -0.299) (zone_connect 2) (tstamp 469df793-f33d-41cd-9b5c-00ed8cee8c14))
(pad "49" thru_hole circle (at -1.524 -1.524) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
(solder_mask_margin -0.299) (zone_connect 2) (tstamp 9f2e1f61-0a01-4d05-83f5-3f74a884faa3))
(pad "49" thru_hole circle (at 1.524 1.524 180) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
(solder_mask_margin -0.299) (zone_connect 2) (tstamp bc412c42-be50-43b8-8c75-cd975fbb3ca5))
(pad "49" thru_hole circle (at -1.524 1.524 90) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
(solder_mask_margin -0.299) (zone_connect 2) (tstamp e9ad732c-39a0-4f85-bb64-c1634a3ecf95))
(model "${KIPRJMOD}/../mta1-library/mta1.pretty/3d_models/ICE40UP5K-SG48ITR.step"
(offset (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz -90 0 90))
)
)

31
hw/boards/mta1-library/mta1.pretty/MC2016Z.kicad_mod
View File

@ -1,31 +0,0 @@
(footprint "MC2016Z" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 616D9B54)
(attr smd)
(fp_text reference "REF**" (at 0 -2.54) (layer "F.SilkS")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 70287de0-48a5-4423-9df4-b3637a983995)
)
(fp_text value "MC2016Z" (at 0 2.54) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 3ecc3ee0-902e-4f65-a588-ddb47ef0a3d0)
)
(fp_line (start -1.3 -1.1) (end -1.3 1.1) (layer "F.CrtYd") (width 0.05) (tstamp 042359c4-6b3f-4fe2-924f-73a4f515f170))
(fp_line (start 1.3 -1.1) (end 1.3 1.1) (layer "F.CrtYd") (width 0.05) (tstamp 21b67917-58a7-447c-a784-88ee29113dd8))
(fp_line (start 1.3 1.1) (end -1.3 1.1) (layer "F.CrtYd") (width 0.05) (tstamp 429f300a-5a92-4aca-a9e6-ea0cb6ea6035))
(fp_line (start -1.3 -1.1) (end 1.3 -1.1) (layer "F.CrtYd") (width 0.05) (tstamp ff9343d4-84f2-4396-9e02-04aaa31bdb53))
(fp_line (start -1 0.5) (end -1 -0.8) (layer "F.Fab") (width 0.1) (tstamp 5e8d0296-968d-40e7-872d-ccc1afa29217))
(fp_line (start 1 -0.8) (end 1 0.8) (layer "F.Fab") (width 0.1) (tstamp 8a39c6fb-adfe-4cb7-a8fd-aa0789c3fa29))
(fp_line (start -1 0.5) (end -0.7 0.8) (layer "F.Fab") (width 0.1) (tstamp 8e7e2e4c-b30d-4926-beb7-1b6630ee1e61))
(fp_line (start 1 0.8) (end -0.7 0.8) (layer "F.Fab") (width 0.1) (tstamp b06d4c22-a2d3-45a6-8b86-b3abdc291afe))
(fp_line (start -1 -0.8) (end 1 -0.8) (layer "F.Fab") (width 0.1) (tstamp e84ca0fc-9f31-465b-abfa-053f521021f5))
(pad "1" smd rect (at -0.9 0.6) (size 0.6 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp c435196e-d561-4fbb-bac7-9de7ee23985f))
(pad "2" smd rect (at 0.9 0.6) (size 0.6 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp d8897cf8-97c4-48be-a51a-ab1c528c9275))
(pad "3" smd rect (at 0.9 -0.6) (size 0.6 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 39d2c8c1-582d-455e-a286-2c0562871862))
(pad "4" smd rect (at -0.9 -0.6) (size 0.6 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 16ddb3da-3aaf-4c5f-8323-3c95c55ac2ae))
(model "${KIPRJMOD}/../mta1-library/mta1.pretty/3d_models/MC2016Z.step"
(offset (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz -90 0 0))
)
)

40
hw/boards/mta1-library/mta1.pretty/MCP1824T-SOT-23-5.kicad_mod
View File

@ -1,40 +0,0 @@
(footprint "MCP1824T-SOT-23-5" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 61367FF8)
(descr "5-pin SOT23 package")
(tags "SOT-23-5")
(attr smd)
(fp_text reference "REF**" (at 0 -2.9) (layer "F.SilkS")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp a17d7f86-0179-400a-95d2-ed0f6cd17a49)
)
(fp_text value "MCP1824T-SOT-23-5" (at 0 2.9) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp a3f544d4-dd21-44ac-8509-674521c3bf4a)
)
(fp_text user "${REFERENCE}" (at 0 0 90) (layer "F.Fab")
(effects (font (size 0.5 0.5) (thickness 0.075)))
(tstamp 4507dadf-eb27-4a89-8b5f-c0830610c77e)
)
(fp_line (start -0.9 1.61) (end 0.9 1.61) (layer "F.SilkS") (width 0.12) (tstamp 96f5d14b-4279-4869-a4d9-89b9ba5b9326))
(fp_line (start 0.9 -1.61) (end -1.55 -1.61) (layer "F.SilkS") (width 0.12) (tstamp fa031bdf-5e99-42dc-8692-15c30e685b5a))
(fp_line (start -1.9 -1.8) (end 1.9 -1.8) (layer "F.CrtYd") (width 0.05) (tstamp 3676d1ad-dfe9-41bb-9b6c-e14d93943fa2))
(fp_line (start -1.9 1.8) (end -1.9 -1.8) (layer "F.CrtYd") (width 0.05) (tstamp 6acb4a6c-b1db-42c8-a925-721926fe18af))
(fp_line (start 1.9 -1.8) (end 1.9 1.8) (layer "F.CrtYd") (width 0.05) (tstamp af5efa2f-594c-4cd5-abf4-97bbd8a484a5))
(fp_line (start 1.9 1.8) (end -1.9 1.8) (layer "F.CrtYd") (width 0.05) (tstamp b3fd0d04-2d8b-42a2-8f69-962c14297589))
(fp_line (start 0.9 1.55) (end -0.9 1.55) (layer "F.Fab") (width 0.1) (tstamp 344cca83-1ca2-4f3a-9033-74708f6f273d))
(fp_line (start -0.9 -0.9) (end -0.25 -1.55) (layer "F.Fab") (width 0.1) (tstamp 7c1dcaa1-0b4e-40e0-964d-fd434e8d90c2))
(fp_line (start 0.9 -1.55) (end -0.25 -1.55) (layer "F.Fab") (width 0.1) (tstamp 810546bb-88ef-4798-bd6a-845f73a2a903))
(fp_line (start -0.9 -0.9) (end -0.9 1.55) (layer "F.Fab") (width 0.1) (tstamp a0876043-d1a0-43c6-832a-933a920ea949))
(fp_line (start 0.9 -1.55) (end 0.9 1.55) (layer "F.Fab") (width 0.1) (tstamp f009fb07-369f-4627-ae7e-c463dbea31d6))
(pad "1" smd rect (at -1.1 -0.95) (size 1.06 0.65) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 5be42e98-179d-467f-b08d-4146ced5e7eb))
(pad "2" smd rect (at -1.1 0) (size 1.06 0.65) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp bd932edf-7fdc-4b44-8578-1f565b0464cc))
(pad "3" smd rect (at -1.1 0.95) (size 1.06 0.65) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 9db2a5e9-1bf3-44eb-b6b7-29b31eed868d))
(pad "4" smd rect (at 1.1 0.95) (size 1.06 0.65) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 1e24719a-bb94-4cfb-822d-1c2b0bd38b64))
(pad "5" smd rect (at 1.1 -0.95) (size 1.06 0.65) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 08dbfb9c-6164-4cf0-af58-fa4477606202))
(model "${KIPRJMOD}/../mta1-library/mta1.pretty/3d_models/MCP1824T.step"
(offset (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz -90 0 -90))
)
)

38
hw/boards/mta1-library/mta1.pretty/NCP752BSN33T1G.kicad_mod
View File

@ -1,38 +0,0 @@
(footprint "NCP752BSN33T1G" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 616ECE40)
(attr smd)
(fp_text reference "REF**" (at 0 -3.81) (layer "F.SilkS")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp ea5a20bb-c640-47a9-806f-cebd20350c6e)
)
(fp_text value "NCP752BSN33T1G" (at 0 3.81) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 68f3b860-6277-4b0a-881d-06899522ea17)
)
(fp_text user "${REFERENCE}" (at 0 0 90 unlocked) (layer "F.Fab")
(effects (font (size 0.5 0.5) (thickness 0.08)))
(tstamp 86e3dd9b-559d-4b3e-8aa4-cf49dc238d9c)
)
(fp_line (start -0.9 1.61) (end 0.9 1.61) (layer "F.SilkS") (width 0.12) (tstamp 6e5cefcf-65ad-4263-b0f7-e81767e10695))
(fp_line (start 0.9 -1.61) (end -1.55 -1.61) (layer "F.SilkS") (width 0.12) (tstamp e95f7615-6547-498d-94da-56b2857a02ea))
(fp_line (start 1.9 -1.5) (end 1.9 1.5) (layer "F.CrtYd") (width 0.05) (tstamp 61c34542-af3e-42b6-b288-c86e516c35ea))
(fp_line (start -1.9 -1.5) (end 1.9 -1.5) (layer "F.CrtYd") (width 0.05) (tstamp 9548cf5b-a09a-4505-894a-a92b90eefa07))
(fp_line (start -1.9 1.5) (end -1.9 -1.5) (layer "F.CrtYd") (width 0.05) (tstamp a7ade3c5-1d11-4e28-9c66-d7a3210fe984))
(fp_line (start 1.9 1.5) (end -1.9 1.5) (layer "F.CrtYd") (width 0.05) (tstamp cea10542-7924-4256-bef1-d9e9c146e1f5))
(fp_line (start -0.825 1.575) (end -0.825 -1.2) (layer "F.Fab") (width 0.12) (tstamp 856fa11c-f489-4642-99c6-d2369520cc75))
(fp_line (start -0.5 -1.575) (end 0.825 -1.575) (layer "F.Fab") (width 0.12) (tstamp 8a15ba15-f0c9-4c69-b0c7-f497dae6fff5))
(fp_line (start 0.825 -1.575) (end 0.825 1.575) (layer "F.Fab") (width 0.12) (tstamp aab352ee-93c2-4186-9af0-a86a8c96089a))
(fp_line (start 0.825 1.575) (end -0.825 1.575) (layer "F.Fab") (width 0.1) (tstamp d8648659-e0f3-4371-b3af-4ff643c2b44e))
(fp_line (start -0.5 -1.575) (end -0.825 -1.2) (layer "F.Fab") (width 0.12) (tstamp f5d5f9c7-cd53-432e-87df-bf2dacc807c7))
(pad "1" smd rect (at -1.2 -0.95 270) (size 0.7 1) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp ea245e44-4956-45b1-b440-bef9b1d8a885))
(pad "2" smd rect (at -1.2 0 270) (size 0.7 1) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 86cdc1d7-fdb3-4ffc-9f6f-cf5282c31d3b))
(pad "3" smd rect (at -1.2 0.95 270) (size 0.7 1) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 5bff8781-6551-4141-995b-343fb5aa90ae))
(pad "4" smd rect (at 1.2 0.95 270) (size 0.7 1) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 59005e90-31b3-4c2d-b870-1409713c62cf))
(pad "5" smd rect (at 1.2 -0.95 270) (size 0.7 1) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 28707e0a-dd24-4294-bf8c-5773a9252ade))
(model "${KICAD6_3DMODEL_DIR}/Package_TO_SOT_SMD.3dshapes/TSOT-23-5.wrl"
(offset (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)

68
hw/boards/mta1-library/mta1.pretty/PinHeader_1x06_P2.54mm_Horizontal.kicad_mod
View File

@ -1,68 +0,0 @@
(module PinHeader_1x06_P2.54mm_Horizontal (layer F.Cu) (tedit 6137807A)
(descr "Through hole angled pin header, 1x06, 2.54mm pitch, 6mm pin length, single row")
(tags "Through hole angled pin header THT 1x06 2.54mm single row")
(fp_text reference J (at -4.385 14.97) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value PMOD-Device-x1-Type-2-SPI (at 4.385 14.97 180) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -1.524 13.97) (end -4.04 13.97) (layer F.Fab) (width 0.1))
(fp_line (start -4.04 13.97) (end -4.04 -1.27) (layer F.Fab) (width 0.1))
(fp_line (start -4.04 -1.27) (end -1.5 -1.27) (layer F.Fab) (width 0.1))
(fp_line (start -1.5 -1.27) (end -1.524 13.97) (layer F.Fab) (width 0.1))
(fp_line (start 0.32 13.02) (end -1.5 13.02) (layer F.Fab) (width 0.1))
(fp_line (start 0.32 13.02) (end 0.32 12.38) (layer F.Fab) (width 0.1))
(fp_line (start 0.32 12.38) (end -1.5 12.38) (layer F.Fab) (width 0.1))
(fp_line (start -4.04 13.02) (end -10.04 13.02) (layer F.Fab) (width 0.1))
(fp_line (start -10.04 13.02) (end -10.04 12.38) (layer F.Fab) (width 0.1))
(fp_line (start -4.04 12.38) (end -10.04 12.38) (layer F.Fab) (width 0.1))
(fp_line (start 0.32 10.48) (end -1.5 10.48) (layer F.Fab) (width 0.1))
(fp_line (start 0.32 10.48) (end 0.32 9.84) (layer F.Fab) (width 0.1))
(fp_line (start 0.32 9.84) (end -1.5 9.84) (layer F.Fab) (width 0.1))
(fp_line (start -4.04 10.48) (end -10.04 10.48) (layer F.Fab) (width 0.1))
(fp_line (start -10.04 10.48) (end -10.04 9.84) (layer F.Fab) (width 0.1))
(fp_line (start -4.04 9.84) (end -10.04 9.84) (layer F.Fab) (width 0.1))
(fp_line (start 0.32 7.94) (end -1.5 7.94) (layer F.Fab) (width 0.1))
(fp_line (start 0.32 7.94) (end 0.32 7.3) (layer F.Fab) (width 0.1))
(fp_line (start 0.32 7.3) (end -1.5 7.3) (layer F.Fab) (width 0.1))
(fp_line (start -4.04 7.94) (end -10.04 7.94) (layer F.Fab) (width 0.1))
(fp_line (start -10.04 7.94) (end -10.04 7.3) (layer F.Fab) (width 0.1))
(fp_line (start -4.04 7.3) (end -10.04 7.3) (layer F.Fab) (width 0.1))
(fp_line (start 0.32 5.4) (end -1.5 5.4) (layer F.Fab) (width 0.1))
(fp_line (start 0.32 5.4) (end 0.32 4.76) (layer F.Fab) (width 0.1))
(fp_line (start 0.32 4.76) (end -1.5 4.76) (layer F.Fab) (width 0.1))
(fp_line (start -4.04 5.4) (end -10.04 5.4) (layer F.Fab) (width 0.1))
(fp_line (start -10.04 5.4) (end -10.04 4.76) (layer F.Fab) (width 0.1))
(fp_line (start -4.04 4.76) (end -10.04 4.76) (layer F.Fab) (width 0.1))
(fp_line (start 0.32 2.86) (end -1.5 2.86) (layer F.Fab) (width 0.1))
(fp_line (start 0.32 2.86) (end 0.32 2.22) (layer F.Fab) (width 0.1))
(fp_line (start 0.32 2.22) (end -1.5 2.22) (layer F.Fab) (width 0.1))
(fp_line (start -4.04 2.86) (end -10.04 2.86) (layer F.Fab) (width 0.1))
(fp_line (start -10.04 2.86) (end -10.04 2.22) (layer F.Fab) (width 0.1))
(fp_line (start -4.04 2.22) (end -10.04 2.22) (layer F.Fab) (width 0.1))
(fp_line (start 0.32 0.32) (end -1.5 0.32) (layer F.Fab) (width 0.1))
(fp_line (start 0.32 0.32) (end 0.32 -0.32) (layer F.Fab) (width 0.1))
(fp_line (start 0.32 -0.32) (end -1.5 -0.32) (layer F.Fab) (width 0.1))
(fp_line (start -4.04 0.32) (end -10.04 0.32) (layer F.Fab) (width 0.1))
(fp_line (start -10.04 0.32) (end -10.04 -0.32) (layer F.Fab) (width 0.1))
(fp_line (start -4.04 -0.32) (end -10.04 -0.32) (layer F.Fab) (width 0.1))
(fp_line (start 1.8 14.5) (end 1.8 -1.8) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.8 -1.8) (end -10.55 -1.8) (layer F.CrtYd) (width 0.05))
(fp_line (start -10.55 -1.8) (end -10.55 14.5) (layer F.CrtYd) (width 0.05))
(fp_line (start -10.55 14.5) (end 1.8 14.5) (layer F.CrtYd) (width 0.05))
(fp_text user %R (at -2.77 6.35 270) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(pad 6 thru_hole oval (at 0 12.7) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
(pad 5 thru_hole oval (at 0 10.16) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
(pad 4 thru_hole oval (at 0 7.62) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
(pad 3 thru_hole oval (at 0 5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
(pad 2 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
(pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
(model ${KICAD6_3DMODEL_DIR}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x06_P2.54mm_Horizontal.wrl
(offset (xyz 0 -12.7 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 180))
)
)

28
hw/boards/mta1-library/mta1.pretty/TestPoint_Pad_D1.0mm.kicad_mod
View File

@ -1,28 +0,0 @@
(footprint "TestPoint_Pad_D1.0mm" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 5A0F774F)
(descr "SMD pad as test Point, diameter 1.0mm")
(tags "test point SMD pad")
(attr exclude_from_pos_files exclude_from_bom)
(fp_text reference "REF**" (at 0 -2) (layer "F.SilkS")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp ed08342a-eaee-43e9-b96e-1dd00b47763e)
)
(fp_text value "TestPoint_rect1_1.6" (at 0 2) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp a41410ba-6764-40d3-8271-3889cd1f68dc)
)
(fp_text user "${REFERENCE}" (at 0 -2) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp ecb9d95d-c3e5-4a80-b7be-d742b8cad331)
)
(fp_line (start 0.7 1) (end -0.7 1) (layer "F.SilkS") (width 0.12) (tstamp 0f426fa1-fc2f-405a-ad53-6e830f7ee04b))
(fp_line (start -0.7 1) (end -0.7 -1) (layer "F.SilkS") (width 0.12) (tstamp 0f47421c-1e82-4036-b8e8-a06d02b43b87))
(fp_line (start -0.7 -1) (end 0.7 -1) (layer "F.SilkS") (width 0.12) (tstamp 3bad0292-560e-4959-9af2-db7bbf622092))
(fp_line (start 0.7 -1) (end 0.7 1) (layer "F.SilkS") (width 0.12) (tstamp f094a04e-97d3-4bf8-800d-8371147afe46))
(fp_line (start 0.9 1.2) (end -0.9 1.2) (layer "F.CrtYd") (width 0.05) (tstamp 37081654-8f99-4a40-95a5-cb89ab90304e))
(fp_line (start -0.9 -1.2) (end 0.9 -1.2) (layer "F.CrtYd") (width 0.05) (tstamp 97660885-3db5-4ad6-a54d-91f2fd79e84a))
(fp_line (start -0.9 1.2) (end -0.9 -1.2) (layer "F.CrtYd") (width 0.05) (tstamp df586b02-02b3-429d-a0c0-fe4a87110a37))
(fp_line (start 0.9 -1.2) (end 0.9 1.2) (layer "F.CrtYd") (width 0.05) (tstamp e2dc4785-3e17-472a-82b9-5050a49344b6))
(pad "1" smd roundrect (at 0 0) (size 1 1.6) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.25) (tstamp bab732e9-e79a-410d-8a2b-e7d9e8d299bb))
)

70
hw/boards/mta1-library/mta1.pretty/U261-241N-4BS60.kicad_mod
View File

@ -1,70 +0,0 @@
(footprint "U261-241N-4BS60" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 0)
(attr smd)
(fp_text reference "p**" (at 0 6 unlocked) (layer "F.SilkS")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp a5909492-b68b-47b5-b3df-4a73813624d6)
)
(fp_text value "U261-241N-4BS60" (at 0 7.5 unlocked) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 19e90bfe-f65f-43c6-9cdd-8c125d76e597)
)
(fp_text user "${REFERENCE}" (at 0 9 unlocked) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 197d02fb-97b2-4f49-8a55-7a7a2968ec81)
)
(fp_line (start -1.95 -3.05) (end -1.95 3.05) (layer "Edge.Cuts") (width 0.05) (tstamp 75dc6972-0628-4bc4-9a7e-d160b69fe920))
(fp_line (start -1.95 3.05) (end -1.05 3.05) (layer "Edge.Cuts") (width 0.05) (tstamp 799d7ade-e82c-4a76-8037-81fef6257dcb))
(fp_line (start -1.95 -3.05) (end -1.05 -3.05) (layer "Edge.Cuts") (width 0.05) (tstamp 8475e8e0-da24-483c-8120-57ca7be2f880))
(fp_line (start -1.05 -3.05) (end -1.05 -3.95) (layer "Edge.Cuts") (width 0.05) (tstamp 88fe65e8-3e79-4518-9ef6-eb68c77d3692))
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(scale (xyz 1 1 1))
(rotate (xyz 180 0 90))
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52
hw/boards/mta1-library/mta1.pretty/W25Q80DVUXIE.kicad_mod
View File

@ -1,52 +0,0 @@
(footprint "W25Q80DVUXIE" (version 20211014) (generator pcbnew)
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(tedit 0)
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(effects (font (size 1 1) (thickness 0.15)))
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273
hw/boards/mta1-library/mta1.pretty/logo_OPENHARDWARE_4mmX4mm.kicad_mod
View File

@ -1,273 +0,0 @@
(footprint "logo_OPENHARDWARE_4mmX4mm" (version 20211014) (generator pcbnew)
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hw/boards/mta1-library/mta1.pretty/mta1_usb_ch552_flat.kicad_mod
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hw/boards/mta1-library/mta1.pretty/mta1_usb_ch554_pogo.kicad_mod
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(model "${KIPRJMOD}/../mta1-library/mta1.pretty/3d_models/mta1_usb_ch554_pogo.step"
(offset (xyz 0 0 15.5))
(scale (xyz 1 1 1))
(rotate (xyz -90 0 0))
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338
hw/boards/mta1-library/mta1.pretty/tillitis_logo.kicad_mod
View File

@ -1,338 +0,0 @@
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15
hw/boards/mta1-usb-dev/.gitignore vendored
View File

@ -1,15 +0,0 @@
# Ignore list for KiCAD Projects
*.000
*.bak
*.bck
*.kicad_pcb-bak
*.sch-bak
*~_autosave-*
*.tmp
*-save.pro
*-save.kicad_pcb
fp-info-cache
*.net
*.dsn
*.ses
*.swp

289
hw/boards/mta1-usb-dev/LICENSE.txt
View File

@ -1,289 +0,0 @@
CERN Open Hardware Licence Version 2 - Strongly Reciprocal
Preamble
CERN has developed this licence to promote collaboration among
hardware designers and to provide a legal tool which supports the
freedom to use, study, modify, share and distribute hardware designs
and products based on those designs. Version 2 of the CERN Open
Hardware Licence comes in three variants: CERN-OHL-P (permissive); and
two reciprocal licences: CERN-OHL-W (weakly reciprocal) and this
licence, CERN-OHL-S (strongly reciprocal).
The CERN-OHL-S is copyright CERN 2020. Anyone is welcome to use it, in
unmodified form only.
Use of this Licence does not imply any endorsement by CERN of any
Licensor or their designs nor does it imply any involvement by CERN in
their development.
1 Definitions
1.1 'Licence' means this CERN-OHL-S.
1.2 'Compatible Licence' means
a) any earlier version of the CERN Open Hardware licence, or
b) any version of the CERN-OHL-S, or
c) any licence which permits You to treat the Source to which
it applies as licensed under CERN-OHL-S provided that on
Conveyance of any such Source, or any associated Product You
treat the Source in question as being licensed under
CERN-OHL-S.
1.3 'Source' means information such as design materials or digital
code which can be applied to Make or test a Product or to
prepare a Product for use, Conveyance or sale, regardless of its
medium or how it is expressed. It may include Notices.
1.4 'Covered Source' means Source that is explicitly made available
under this Licence.
1.5 'Product' means any device, component, work or physical object,
whether in finished or intermediate form, arising from the use,
application or processing of Covered Source.
1.6 'Make' means to create or configure something, whether by
manufacture, assembly, compiling, loading or applying Covered
Source or another Product or otherwise.
1.7 'Available Component' means any part, sub-assembly, library or
code which:
a) is licensed to You as Complete Source under a Compatible
Licence; or
b) is available, at the time a Product or the Source containing
it is first Conveyed, to You and any other prospective
licensees
i) as a physical part with sufficient rights and
information (including any configuration and
programming files and information about its
characteristics and interfaces) to enable it either to
be Made itself, or to be sourced and used to Make the
Product; or
ii) as part of the normal distribution of a tool used to
design or Make the Product.
1.8 'Complete Source' means the set of all Source necessary to Make
a Product, in the preferred form for making modifications,
including necessary installation and interfacing information
both for the Product, and for any included Available Components.
If the format is proprietary, it must also be made available in
a format (if the proprietary tool can create it) which is
viewable with a tool available to potential licensees and
licensed under a licence approved by the Free Software
Foundation or the Open Source Initiative. Complete Source need
not include the Source of any Available Component, provided that
You include in the Complete Source sufficient information to
enable a recipient to Make or source and use the Available
Component to Make the Product.
1.9 'Source Location' means a location where a Licensor has placed
Covered Source, and which that Licensor reasonably believes will
remain easily accessible for at least three years for anyone to
obtain a digital copy.
1.10 'Notice' means copyright, acknowledgement and trademark notices,
Source Location references, modification notices (subsection
3.3(b)) and all notices that refer to this Licence and to the
disclaimer of warranties that are included in the Covered
Source.
1.11 'Licensee' or 'You' means any person exercising rights under
this Licence.
1.12 'Licensor' means a natural or legal person who creates or
modifies Covered Source. A person may be a Licensee and a
Licensor at the same time.
1.13 'Convey' means to communicate to the public or distribute.
2 Applicability
2.1 This Licence governs the use, copying, modification, Conveying
of Covered Source and Products, and the Making of Products. By
exercising any right granted under this Licence, You irrevocably
accept these terms and conditions.
2.2 This Licence is granted by the Licensor directly to You, and
shall apply worldwide and without limitation in time.
2.3 You shall not attempt to restrict by contract or otherwise the
rights granted under this Licence to other Licensees.
2.4 This Licence is not intended to restrict fair use, fair dealing,
or any other similar right.
3 Copying, Modifying and Conveying Covered Source
3.1 You may copy and Convey verbatim copies of Covered Source, in
any medium, provided You retain all Notices.
3.2 You may modify Covered Source, other than Notices, provided that
You irrevocably undertake to make that modified Covered Source
available from a Source Location should You Convey a Product in
circumstances where the recipient does not otherwise receive a
copy of the modified Covered Source. In each case subsection 3.3
shall apply.
You may only delete Notices if they are no longer applicable to
the corresponding Covered Source as modified by You and You may
add additional Notices applicable to Your modifications.
Including Covered Source in a larger work is modifying the
Covered Source, and the larger work becomes modified Covered
Source.
3.3 You may Convey modified Covered Source (with the effect that You
shall also become a Licensor) provided that You:
a) retain Notices as required in subsection 3.2;
b) add a Notice to the modified Covered Source stating that You
have modified it, with the date and brief description of how
You have modified it;
c) add a Source Location Notice for the modified Covered Source
if You Convey in circumstances where the recipient does not
otherwise receive a copy of the modified Covered Source; and
d) license the modified Covered Source under the terms and
conditions of this Licence (or, as set out in subsection
8.3, a later version, if permitted by the licence of the
original Covered Source). Such modified Covered Source must
be licensed as a whole, but excluding Available Components
contained in it, which remain licensed under their own
applicable licences.
4 Making and Conveying Products
You may Make Products, and/or Convey them, provided that You either
provide each recipient with a copy of the Complete Source or ensure
that each recipient is notified of the Source Location of the Complete
Source. That Complete Source is Covered Source, and You must
accordingly satisfy Your obligations set out in subsection 3.3. If
specified in a Notice, the Product must visibly and securely display
the Source Location on it or its packaging or documentation in the
manner specified in that Notice.
5 Research and Development
You may Convey Covered Source, modified Covered Source or Products to
a legal entity carrying out development, testing or quality assurance
work on Your behalf provided that the work is performed on terms which
prevent the entity from both using the Source or Products for its own
internal purposes and Conveying the Source or Products or any
modifications to them to any person other than You. Any modifications
made by the entity shall be deemed to be made by You pursuant to
subsection 3.2.
6 DISCLAIMER AND LIABILITY
6.1 DISCLAIMER OF WARRANTY -- The Covered Source and any Products
are provided 'as is' and any express or implied warranties,
including, but not limited to, implied warranties of
merchantability, of satisfactory quality, non-infringement of
third party rights, and fitness for a particular purpose or use
are disclaimed in respect of any Source or Product to the
maximum extent permitted by law. The Licensor makes no
representation that any Source or Product does not or will not
infringe any patent, copyright, trade secret or other
proprietary right. The entire risk as to the use, quality, and
performance of any Source or Product shall be with You and not
the Licensor. This disclaimer of warranty is an essential part
of this Licence and a condition for the grant of any rights
granted under this Licence.
6.2 EXCLUSION AND LIMITATION OF LIABILITY -- The Licensor shall, to
the maximum extent permitted by law, have no liability for
direct, indirect, special, incidental, consequential, exemplary,
punitive or other damages of any character including, without
limitation, procurement of substitute goods or services, loss of
use, data or profits, or business interruption, however caused
and on any theory of contract, warranty, tort (including
negligence), product liability or otherwise, arising in any way
in relation to the Covered Source, modified Covered Source
and/or the Making or Conveyance of a Product, even if advised of
the possibility of such damages, and You shall hold the
Licensor(s) free and harmless from any liability, costs,
damages, fees and expenses, including claims by third parties,
in relation to such use.
7 Patents
7.1 Subject to the terms and conditions of this Licence, each
Licensor hereby grants to You a perpetual, worldwide,
non-exclusive, no-charge, royalty-free, irrevocable (except as
stated in subsections 7.2 and 8.4) patent licence to Make, have
Made, use, offer to sell, sell, import, and otherwise transfer
the Covered Source and Products, where such licence applies only
to those patent claims licensable by such Licensor that are
necessarily infringed by exercising rights under the Covered
Source as Conveyed by that Licensor.
7.2 If You institute patent litigation against any entity (including
a cross-claim or counterclaim in a lawsuit) alleging that the
Covered Source or a Product constitutes direct or contributory
patent infringement, or You seek any declaration that a patent
licensed to You under this Licence is invalid or unenforceable
then any rights granted to You under this Licence shall
terminate as of the date such process is initiated.
8 General
8.1 If any provisions of this Licence are or subsequently become
invalid or unenforceable for any reason, the remaining
provisions shall remain effective.
8.2 You shall not use any of the name (including acronyms and
abbreviations), image, or logo by which the Licensor or CERN is
known, except where needed to comply with section 3, or where
the use is otherwise allowed by law. Any such permitted use
shall be factual and shall not be made so as to suggest any kind
of endorsement or implication of involvement by the Licensor or
its personnel.
8.3 CERN may publish updated versions and variants of this Licence
which it considers to be in the spirit of this version, but may
differ in detail to address new problems or concerns. New
versions will be published with a unique version number and a
variant identifier specifying the variant. If the Licensor has
specified that a given variant applies to the Covered Source
without specifying a version, You may treat that Covered Source
as being released under any version of the CERN-OHL with that
variant. If no variant is specified, the Covered Source shall be
treated as being released under CERN-OHL-S. The Licensor may
also specify that the Covered Source is subject to a specific
version of the CERN-OHL or any later version in which case You
may apply this or any later version of CERN-OHL with the same
variant identifier published by CERN.
8.4 This Licence shall terminate with immediate effect if You fail
to comply with any of its terms and conditions.
8.5 However, if You cease all breaches of this Licence, then Your
Licence from any Licensor is reinstated unless such Licensor has
terminated this Licence by giving You, while You remain in
breach, a notice specifying the breach and requiring You to cure
it within 30 days, and You have failed to come into compliance
in all material respects by the end of the 30 day period. Should
You repeat the breach after receipt of a cure notice and
subsequent reinstatement, this Licence will terminate
immediately and permanently. Section 6 shall continue to apply
after any termination.
8.6 This Licence shall not be enforceable except by a Licensor
acting as such, and third party beneficiary rights are
specifically excluded.

3481
hw/boards/mta1-usb-dev/application_fpga.kicad_sch
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12789
hw/boards/mta1-usb-dev/gerbers/mta1_usb_dev-B_Cu.gbl
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File diff suppressed because it is too large Load Diff

192
hw/boards/mta1-usb-dev/gerbers/mta1_usb_dev-B_Mask.gbs
View File

@ -1,192 +0,0 @@
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%LPD*%
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D13*
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D18*
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D16*
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M02*

15
hw/boards/mta1-usb-dev/gerbers/mta1_usb_dev-B_Paste.gbp
View File

@ -1,15 +0,0 @@
G04 #@! TF.GenerationSoftware,KiCad,Pcbnew,(5.1.10)-1*
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%MOMM*%
%LPD*%
G01*
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M02*

193
hw/boards/mta1-usb-dev/gerbers/mta1_usb_dev-B_SilkS.gbo
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@ -1,193 +0,0 @@
G04 #@! TF.GenerationSoftware,KiCad,Pcbnew,(5.1.10)-1*
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%MOMM*%
%LPD*%
G01*
G04 APERTURE LIST*
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46
hw/boards/mta1-usb-dev/gerbers/mta1_usb_dev-Edge_Cuts.gm1
View File

@ -1,46 +0,0 @@
G04 #@! TF.GenerationSoftware,KiCad,Pcbnew,(5.1.10)-1*
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8485
hw/boards/mta1-usb-dev/gerbers/mta1_usb_dev-F_Cu.gtl
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5806
hw/boards/mta1-usb-dev/gerbers/mta1_usb_dev-F_Mask.gts
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6482
hw/boards/mta1-usb-dev/gerbers/mta1_usb_dev-F_Paste.gtp
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12124
hw/boards/mta1-usb-dev/gerbers/mta1_usb_dev-F_SilkS.gto
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12779
hw/boards/mta1-usb-dev/gerbers/mta1_usb_dev-In1_Cu.g2
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File diff suppressed because it is too large Load Diff

6569
hw/boards/mta1-usb-dev/gerbers/mta1_usb_dev-In2_Cu.g3
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580
hw/boards/mta1-usb-dev/gerbers/mta1_usb_dev-NPTH-drl_map.gbr
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@ -1,580 +0,0 @@
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G04 APERTURE END LIST*
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3310
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File diff suppressed because it is too large Load Diff

286
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hw/boards/mta1-usb-dev/interface_fpga.kicad_sch
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File diff suppressed because it is too large Load Diff

21429
hw/boards/mta1-usb-dev/mta1_usb_dev.kicad_pcb
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File diff suppressed because it is too large Load Diff

75
hw/boards/mta1-usb-dev/mta1_usb_dev.kicad_prl
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3730
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BIN
hw/boards/mta1-usb-dev/mta1_usb_dev.pdf
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28889
hw/boards/mta1-usb-dev/powersupply.kicad_sch
View File

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1005
hw/boards/mta1-usb-dev/programming_interface.kicad_sch
View File

File diff suppressed because it is too large Load Diff

3
hw/boards/mta1-usb-dev/sym-lib-table
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@ -1,3 +0,0 @@
(sym_lib_table
(lib (name "mta1")(type "KiCad")(uri "${KIPRJMOD}/../mta1-library/mta1.kicad_sym")(options "")(descr ""))
)

102
hw/boards/mta1-usb-dev/test/README.md
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# MTA1-USB-DEV hardware test
This is a collection of hardware bringup tests for the MTA1-USB-DEV board. The goal is to verify that the board has been manufactured correctly.
## Power tests
### Voltage rails
The MTA1-USB-DEV board has three voltage supplies- 1.2V, 3.3V, and 2.5V. These are measured by hand using a sufficiently accurate DMM. Additionally, the power supplies must come up in a specific sequence (see the notes on schematic page 2). This can be verified using an oscilloscope. No specific program is required to be loaded on the FPGAs.
![](voltage_rail_test_setup.jpg)
Instructions for testing power-on sequence (note: similar procedure applies for testing with logic analyzer):
1. Remove the FTDI programming daughterboard from the MTA1-USB-DEV board
2. Attach test leads to the 1.2V, 2.5V, 3.3V, and 5V input test pads on the dev board, and to ground points physically near these test points.
3. Connect oscilloscope probe leads to each of these connections. Alternatively, a logic analyzer with analog function can be used for this purpose.
4. Configure the vertical scale of each input to 0.5V/division. Configure the horizontal scale to ?ms/division.
5. Configure the trigger to use the 5V channel as an input, and to a positive-edge trigger, with the reference set to 0.5V.
6. Configure the acquisition mode to 'normal'
7. Apply power to the board using a USB C cable.
8. The full power-on sequence should be captured by the oscilloscope. Verify that it meets the timing requirements detailed in the schematic.
![](voltage_rails_test.png)
Instructions for testing the accuracies of each voltage supply:
1. Remove the FTDI programming daughterboard from the MTA1-USB-DEV board
2. Apply power to the board using a USB C cable.
3. Use a sufficiently accurate DMM to measure the voltage of the 1.2V, 2.5V, and 3.3V rails, at their test points.
TODO: Set specs for this.
### Inrush current (optional)
The inrush current for USB is limited to < xxx mA. Use a current probe to check that the inrush current is lower than the spec.
## GPIO test
This test verifies that all digital lines on the board are connected correctly. To achieve this, unique signals are routed through each connection on each FPGA, and their outputs are measured manually using a logic analyzer or oscilloscope. This is intended to lay the basis for an automated production test.
![](gpio_test_setup.jpg)
Instructions:
1. Attach the FTDI programming daughterboard to the MTA1-USB-DEV board.
2. Set the programming jumpers for both the interface and application FPGAs to the 'flash' setting.
3. Attach a logic analyzer to GPIO1-4 on both the interface and application fpgas.
4. Connect the FTDI board to a computer using a USB A to USB mini cable. Do not connect anything to the USB C port on the MTA1-USB-DEV board.
5. Run the included script 'gpio_test.sh' to automatically build the test gateware, and to load it into the flash memories for each FPGA.
5. Verify that the LEDs are blinking, and that all colors (R, G, and B) are visible.
6. Press the user button on the application FPGA. Verify that the appliction LED turns off.
7. Release the user button the application FPGA. Verify that the application LED turns back on.
8. Configure the logic analyzer to read all GPIO channels. Verifiy that each GPIO is outputting square waves at different frequencies:
![](gpio_test.png)
Explanations of how each subcircuit are covered by this test follow.
### Interface and Application FPGA programming connections
This inclues '_ICE_MISO, _ICE_MOSI, _ICE_SCK, _ICE_SS, _CRESET, _CDONE'. These nets are tested by using the FTDI chip to program the FPGAs in 'live' mode. All nets need to be connected correctly to their respective FPGA for the programming to succeed.
Next, the programming jumpers must be configured to target flash, and the FTDI chip is then used program the SPI flashes. If the FPGAs boot, then it is assumed that the nets are also connected to the SPI flashes.
### Interface FPGA to App FPGA connections
This includes nets 'MISO, SCK, MOSI, SS', as well as EXTRA1-EXTRA10. These pins are tested by passing a single clock signal back and forth between the two FPGAs. The clock signal is first output from the interface FPGA on the HOST_SS net. It is then used as a clock input on the application FGPA, where it is divided by two, then output by the application FPGA on the HOST_SCK net. This strategy continues until all pins are used. All connections can then be verified at once by looking at the clock frequency of the final net, HOST_EXTRA10. This should be ~2.93KHz.
### GPIO connections
Both the interface and application FPGAs have '_GPIO1, _GPIO2, _GPIO3, _GPIO4' expansion connections. These are tested by outputting different frequency clocks to them, which are manually verified using a logic analyzer or oscilloscope.
### RGB LEDs
Both the interface and application FPGAs have RGB status LEDs. These are verified by feeding different clock signals into each color channel, so that the LEDs will rapidly cycle through many output colors. The LED connections can then be verified by looking at them.
### Interface FPGA 48MHz clock
The external clock that is connected to the interface FPGA has a test pad that can be used by a high precision counter to measure both frequency and clock stability. For the initial bringup test, only the frequency is measured.
### Application FPGA user button
The user button is used to gate the output of the application FPGA LED. The button is considered connected if it turns off the application FPGA LED when it is pressed.
## USB test
The USB connection on the interface FPGA is verified by loading a USB-capable bitstream onto the interface FPGA, and verifying that a Linux-based host is able to see the device.
![](usb_test_setup.jpg)
Instructions:
1. Attach the FTDI programming daughterboard to the MTA1-USB-DEV board.
2. Set the programming jumpers for both the interface and application FPGAs to the 'flash' setting.
3. Connect the FTDI board to a computer (running Linux) using a USB A to USB mini cable.
4. Connect the USB C port to the computer using a USB A to USB C cable.
5. Run the included script 'usb_test.sh'. The script will load a USB bitstream into the application FPGA
6. After a short delay, the script will test if the USB device has attached to the computer, and print the test result.

59
hw/boards/mta1-usb-dev/test/app_test/Makefile
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TARGET = top
VERILOG_FILES = \
top.v
PIN_CONFIG_FILE = app.pcf
default: $(TARGET).bin
$(TARGET).json: $(VERILOG_FILES)
yosys \
-q \
-p "synth_ice40 -abc2 -relut -top ${TARGET} -json $(TARGET).json" \
-l $(TARGET)-yosys.log \
$(VERILOG_FILES)
TARGET_MODULE = top
view-ideal:
yosys -p 'read_verilog ${VERILOG_FILES}; proc; opt; select ${TARGET_MODULE}; show -format dot -viewer xdot -pause' &
view-real:
yosys -p 'read_verilog ${VERILOG_FILES}; proc; opt; synth_ice40; show -format dot -viewer xdot -pause' &
$(TARGET).asc: $(TARGET).json $(PIN_CONFIG_FILE)
nextpnr-ice40 \
--up5k \
--package sg48 \
--json $(TARGET).json \
--pcf $(PIN_CONFIG_FILE) \
--asc $(TARGET).asc \
-l $(TARGET)-nextpnr.log
$(TARGET).bin: $(TARGET).asc
icepack $(TARGET).asc $(TARGET).bin
stats: $(TARGET).json $(TARGET).asc
sed -n '/=== top ===/,/6\.28/p' $(TARGET)-yosys.log
sed -n '/Info: Device utilisation/,/Info: Placed/p' $(TARGET)-nextpnr.log
fgrep 'Info: Max frequency for clock' $(TARGET)-nextpnr.log
lint: $(VERILOG_FILES)
verilator --lint-only -Wall -Wno-DECLFILENAME -Ihw_blocks $(VERILOG_FILES)
.PHONY: flash
flash: ${TARGET}.bin
iceprog -I A ${TARGET}.bin
.PHONY: load
load: ${TARGET}.bin
iceprog -S -I A ${TARGET}.bin
.PHONY: clean
clean:
$(RM) -f \
$(TARGET).json \
$(TARGET).asc \
$(TARGET)-yosys.log \
$(TARGET)-nextpnr.log \
$(TARGET).bin

17
hw/boards/mta1-usb-dev/test/app_test/SB_HFOSC.v
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module SB_HFOSC #(
parameter CLKHF_DIV
) (
input CLKHFPU,
input CLKHFEN,
output reg CLKHF
);
// Nonfunctional, for linting only.
always @(*) begin
CLKHF = (CLKHFPU & CLKHFEN);
end
endmodule

34
hw/boards/mta1-usb-dev/test/app_test/SB_RGBA_DRV.v
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module SB_RGBA_DRV #(
parameter CURRENT_MODE,
parameter RGB0_CURRENT,
parameter RGB1_CURRENT,
parameter RGB2_CURRENT
) (
output reg RGB0,
output reg RGB1,
output reg RGB2,
input RGBLEDEN,
input RGB0PWM,
input RGB1PWM,
input RGB2PWM,
input CURREN
);
// Nonfunctional, for linting only.
always @(*) begin
RGB0 = (RGBLEDEN & CURREN & RGB0PWM);
end
always @(*) begin
RGB1 = (RGBLEDEN & CURREN & RGB1PWM);
end
always @(*) begin
RGB2 = (RGBLEDEN & CURREN & RGB2PWM);
end
endmodule

29
hw/boards/mta1-usb-dev/test/app_test/app.pcf
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@ -1,29 +0,0 @@
# Host Communication
set_io HOST_SS 42
set_io HOST_SCK 43
set_io HOST_MOSI 44
set_io HOST_MISO 45
set_io HOST_EXTRA1 46
set_io HOST_EXTRA2 47
set_io HOST_EXTRA3 48
set_io HOST_EXTRA4 2
set_io HOST_EXTRA5 3
set_io HOST_EXTRA6 4
set_io HOST_EXTRA7 9
set_io HOST_EXTRA8 10
set_io HOST_EXTRA9 11
set_io HOST_EXTRA10 12
# Expansion
set_io APP_GPIO1 38
set_io APP_GPIO2 37
set_io APP_GPIO3 36
set_io APP_GPIO4 35
## User IO
set_io APP_BUTTON 34
set_io RGB0 39
set_io RGB1 40
set_io RGB2 41

105
hw/boards/mta1-usb-dev/test/app_test/top.v
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module top (
input HOST_SS,
output reg HOST_SCK,
input HOST_MOSI,
output reg HOST_MISO,
input HOST_EXTRA1,
output reg HOST_EXTRA2,
input HOST_EXTRA3,
output reg HOST_EXTRA4,
input HOST_EXTRA5,
output reg HOST_EXTRA6,
input HOST_EXTRA7,
output reg HOST_EXTRA8,
input HOST_EXTRA9,
output reg HOST_EXTRA10,
output APP_GPIO1,
output APP_GPIO2,
output APP_GPIO3,
output APP_GPIO4,
input APP_BUTTON,
output RGB0,
output RGB1,
output RGB2
);
//############ Feedback test ############################################
always @(posedge HOST_SS) begin
HOST_SCK <= ~HOST_SCK;
end
always @(posedge HOST_MOSI) begin
HOST_MISO <= ~HOST_MISO;
end
always @(posedge HOST_EXTRA1) begin
HOST_EXTRA2 <= ~HOST_EXTRA2;
end
always @(posedge HOST_EXTRA3) begin
HOST_EXTRA4 <= ~HOST_EXTRA4;
end
always @(posedge HOST_EXTRA5) begin
HOST_EXTRA6 <= ~HOST_EXTRA6;
end
always @(posedge HOST_EXTRA7) begin
HOST_EXTRA8 <= ~HOST_EXTRA8;
end
always @(posedge HOST_EXTRA9) begin
HOST_EXTRA10 <= ~HOST_EXTRA10;
end
reg [10:0] slow_led;
always @(posedge HOST_EXTRA10) begin
slow_led <= slow_led + 1;
end
SB_RGBA_DRV #(
.CURRENT_MODE("0b1"), // half-current mode
.RGB0_CURRENT("0b000001"), // 2 mA
.RGB1_CURRENT("0b000001"), // 2 mA
.RGB2_CURRENT("0b000001") // 2 mA
) RGBA_DRV (
.RGB0(RGB0),
.RGB1(RGB1),
.RGB2(RGB2),
//.RGBLEDEN(1'b1),
.RGBLEDEN(APP_BUTTON),
.RGB0PWM(slow_led[10]),
.RGB1PWM(slow_led[9]),
.RGB2PWM(slow_led[8]),
.CURREN(1'b1)
);
//############ Clock / Reset ############################################
wire clk;
// Configure the HFOSC
SB_HFOSC #(
.CLKHF_DIV("0b01") // 00: 48MHz, 01: 24MHz, 10: 12MHz, 11: 6MHz
) u_hfosc (
.CLKHFPU(1'b1),
.CLKHFEN(1'b1),
.CLKHF(clk)
);
//############ GPIO tests ###############################################
assign APP_GPIO1 = clk;
assign APP_GPIO2 = HOST_SS;
assign APP_GPIO3 = HOST_EXTRA8;
assign APP_GPIO4 = HOST_EXTRA10;
endmodule

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hw/boards/mta1-usb-dev/test/gpio_test.png
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9
hw/boards/mta1-usb-dev/test/gpio_test.sh
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@ -1,9 +0,0 @@
#!/bin/bash
pushd app_test
make flash
popd
pushd int_test
make flash
popd

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hw/boards/mta1-usb-dev/test/gpio_test_setup.jpg
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BIN
hw/boards/mta1-usb-dev/test/int_test/.app.pcf.swp
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59
hw/boards/mta1-usb-dev/test/int_test/Makefile
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@ -1,59 +0,0 @@
TARGET = top
VERILOG_FILES = \
top.v
PIN_CONFIG_FILE = int.pcf
default: $(TARGET).bin
$(TARGET).json: $(VERILOG_FILES)
yosys \
-q \
-p "synth_ice40 -abc2 -relut -top ${TARGET} -json $(TARGET).json" \
-l $(TARGET)-yosys.log \
$(VERILOG_FILES)
TARGET_MODULE = top
view-ideal:
yosys -p 'read_verilog ${VERILOG_FILES}; proc; opt; select ${TARGET_MODULE}; show -format dot -viewer xdot -pause' &
view-real:
yosys -p 'read_verilog ${VERILOG_FILES}; proc; opt; synth_ice40; show -format dot -viewer xdot -pause' &
$(TARGET).asc: $(TARGET).json $(PIN_CONFIG_FILE)
nextpnr-ice40 \
--up5k \
--package sg48 \
--json $(TARGET).json \
--pcf $(PIN_CONFIG_FILE) \
--asc $(TARGET).asc \
-l $(TARGET)-nextpnr.log
$(TARGET).bin: $(TARGET).asc
icepack $(TARGET).asc $(TARGET).bin
stats: $(TARGET).json $(TARGET).asc
sed -n '/=== top ===/,/6\.28/p' $(TARGET)-yosys.log
sed -n '/Info: Device utilisation/,/Info: Placed/p' $(TARGET)-nextpnr.log
fgrep 'Info: Max frequency for clock' $(TARGET)-nextpnr.log
lint: $(VERILOG_FILES)
verilator --lint-only -Wall -Wno-DECLFILENAME -Ihw_blocks $(VERILOG_FILES)
.PHONY: flash
flash: ${TARGET}.bin
iceprog -I B ${TARGET}.bin
.PHONY: load
load: ${TARGET}.bin
iceprog -S -I B ${TARGET}.bin
.PHONY: clean
clean:
$(RM) -f \
$(TARGET).json \
$(TARGET).asc \
$(TARGET)-yosys.log \
$(TARGET)-nextpnr.log \
$(TARGET).bin

17
hw/boards/mta1-usb-dev/test/int_test/SB_HFOSC.v
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@ -1,17 +0,0 @@
module SB_HFOSC #(
parameter CLKHF_DIV
) (
input CLKHFPU,
input CLKHFEN,
output reg CLKHF
);
// Nonfunctional, for linting only.
always @(*) begin
CLKHF = (CLKHFPU & CLKHFEN);
end
endmodule

34
hw/boards/mta1-usb-dev/test/int_test/SB_RGBA_DRV.v
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@ -1,34 +0,0 @@
module SB_RGBA_DRV #(
parameter CURRENT_MODE,
parameter RGB0_CURRENT,
parameter RGB1_CURRENT,
parameter RGB2_CURRENT
) (
output reg RGB0,
output reg RGB1,
output reg RGB2,
input RGBLEDEN,
input RGB0PWM,
input RGB1PWM,
input RGB2PWM,
input CURREN
);
// Nonfunctional, for linting only.
always @(*) begin
RGB0 = (RGBLEDEN & CURREN & RGB0PWM);
end
always @(*) begin
RGB1 = (RGBLEDEN & CURREN & RGB1PWM);
end
always @(*) begin
RGB2 = (RGBLEDEN & CURREN & RGB2PWM);
end
endmodule

34
hw/boards/mta1-usb-dev/test/int_test/int.pcf
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# Host Communication
set_io HOST_SS 28
set_io HOST_SCK 27
set_io HOST_MOSI 26
set_io HOST_MISO 25
set_io HOST_EXTRA1 23
set_io HOST_EXTRA2 21
set_io HOST_EXTRA3 20
set_io HOST_EXTRA4 19
set_io HOST_EXTRA5 18
set_io HOST_EXTRA6 13
set_io HOST_EXTRA7 12
set_io HOST_EXTRA8 11
set_io HOST_EXTRA9 10
set_io HOST_EXTRA10 9
# USB
#set_io INT_USB_D- 46
#set_io INT_USB_D+ 47
#set_io INT_USB_PU 48
set_io INT_CLOCK 44
# Expansion
set_io INT_GPIO1 38
set_io INT_GPIO2 37
set_io INT_GPIO3 36
set_io INT_GPIO4 35
## User IO
set_io RGB0 39
set_io RGB1 40
set_io RGB2 41

102
hw/boards/mta1-usb-dev/test/int_test/top.v
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module top (
input INT_CLOCK,
output reg HOST_SS,
input HOST_SCK,
output reg HOST_MOSI,
input HOST_MISO,
output reg HOST_EXTRA1,
input HOST_EXTRA2,
output reg HOST_EXTRA3,
input HOST_EXTRA4,
output reg HOST_EXTRA5,
input HOST_EXTRA6,
output reg HOST_EXTRA7,
input HOST_EXTRA8,
output reg HOST_EXTRA9,
input HOST_EXTRA10,
output INT_GPIO1,
output INT_GPIO2,
output INT_GPIO3,
output INT_GPIO4,
output RGB0,
output RGB1,
output RGB2
);
//############ Feedback test ############################################
always @(posedge INT_CLOCK) begin
HOST_SS <= ~HOST_SS;
end
always @(posedge HOST_SCK) begin
HOST_MOSI <= ~HOST_MOSI;
end
always @(posedge HOST_MISO) begin
HOST_EXTRA1 <= ~HOST_EXTRA1;
end
always @(posedge HOST_EXTRA2) begin
HOST_EXTRA3 <= ~HOST_EXTRA3;
end
always @(posedge HOST_EXTRA4) begin
HOST_EXTRA5 <= ~HOST_EXTRA5;
end
always @(posedge HOST_EXTRA6) begin
HOST_EXTRA7 <= ~HOST_EXTRA7;
end
always @(posedge HOST_EXTRA8) begin
HOST_EXTRA9 <= ~HOST_EXTRA9;
end
reg [10:0] slow_led;
always @(posedge HOST_EXTRA10) begin
slow_led <= slow_led + 1;
end
SB_RGBA_DRV #(
.CURRENT_MODE("0b1"), // half-current mode
.RGB0_CURRENT("0b000001"), // 2 mA
.RGB1_CURRENT("0b000001"), // 2 mA
.RGB2_CURRENT("0b000001") // 2 mA
) RGBA_DRV (
.RGB0(RGB0),
.RGB1(RGB1),
.RGB2(RGB2),
.RGBLEDEN(1'b1),
.RGB0PWM(slow_led[10]),
.RGB1PWM(slow_led[9]),
.RGB2PWM(slow_led[8]),
.CURREN(1'b1)
);
//############ Clock / Reset ############################################
wire clk;
// Configure the HFOSC
SB_HFOSC #(
.CLKHF_DIV("0b01") // 00: 48MHz, 01: 24MHz, 10: 12MHz, 11: 6MHz
) u_hfosc (
.CLKHFPU(1'b1),
.CLKHFEN(1'b1),
.CLKHF(clk)
);
//############ GPIO tests ###############################################
assign INT_GPIO1 = clk;
assign INT_GPIO2 = INT_CLOCK;
assign INT_GPIO3 = HOST_EXTRA8;
assign INT_GPIO4 = HOST_EXTRA10;
endmodule

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hw/boards/mta1-usb-dev/test/interface_fpga_usb.bin
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11
hw/boards/mta1-usb-dev/test/usb_test.sh
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#!/bin/bash
set -e
iceprog -I B interface_fpga_usb.bin
echo 'Waiting 2s for USB to stabalize'
sleep 2
if lsusb -d 1d50:6159; then
echo 'device found, USB test passed'
else
echo 'device not found, USB test failed'
fi

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