tillitis-key/hw/boards/tp1/gerbers/tp1-job.gbrjob

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TK-1 and TP-1 PCBs (#52) * Add kicad library for flat programming clip * Add descriptions to part symbols * Add extended values, manufacturer/distributor info to components in mta1 * Add new board entry for TK1 * Add TP1 programmer design * Update MTA1-USB-V1 release files to match production * Change SPI flash memory type to XT25F08BDFIGT-S * Change touch sensor feedback cap to 1uF * Add manufacturer, manufacturer part number, distributor, distributor part number * Update component values for TK1 PCB * Use specific part # for C8 * Change flash back to Winbond part, for easier sourcing * Change C1 to 1pF * Fixes for production programmer PCB * Swap GND and 5V on J3 * Replace graphic logo with text * Rename part to 'TP-1' * TK-1 release * Add dimensions for PCB * Add layer stackup for PCB * Change PCB component origin to match expanded board * Change schematic title to 'TK-1', update release date * mta1-usb-v1-programmer: Add corrected part numbers for OSFC production * Q1, Q2, F1 part subsititutions * add mfr/supplier info for all parts * PCB library: add parts * Rectangular footprint for TK-1 test pads * BOM generation script used for TK-1 and TP-1 releases * TP-1 release * Schematic: Add manufacturer, supplier information for all parts * Schematic: Update name and release date * PCB: Add PCB fabrication information * PCB: Correct pinouts on silkscreen * PCB library: add 'screw' and 'foot' symbols * Screw is a schematic-only part, for including mechanical screws in the BOM * Foot is for self-adhesive rubber mounting feet that can be stuck to the bottom of a PCB * TP-1 release: Add screws, feet to the BOM * Pico library: Add footprint for RPi Pico w/solder paste * TP-1 RevA release updates: * Add fiducials in 3 corners (1mm exposed copper ring w/2mm soldermask opening) * Add solder paste openings to Raspberry Pi Pico pads * TK-1: RevA.1 release * Add two fiducials to TK-1 board * TP-1: Update fuse type to match actual part * Make placement diagrams for TP-1, TK-1 * Update BC-1-xxx footprints to include placement outlines * Update TP-1 PCB with new footprints, clean up top fab layer * Take screenshots of top layers of both boards * tk-1: fix placement footprints * Add pin1 marking for ncp footprint * Add refdes for w25q80 footprint * Update board with new footprints, clear extraneous text on fab layer
2022-12-22 10:41:46 -05:00
{
"Header": {
"GenerationSoftware": {
"Vendor": "KiCad",
"Application": "Pcbnew",
"Version": "(6.0.4)"
},
"CreationDate": "2022-11-15T10:47:26+01:00"
},
"GeneralSpecs": {
"ProjectId": {
"Name": "tp1",
"GUID": "7470312e-6b69-4636-9164-5f7063625858",
"Revision": "rev?"
},
"Size": {
"X": 45.1,
"Y": 87.0929
},
"LayerNumber": 2,
"BoardThickness": 1.6,
"Finish": "ENIG"
},
"DesignRules": [
{
"Layers": "Outer",
"PadToPad": 0.0,
"PadToTrack": 0.0,
"TrackToTrack": 0.2,
"MinLineWidth": 0.2,
"TrackToRegion": 0.508,
"RegionToRegion": 0.508
}
],
"FilesAttributes": [
{
"Path": "tp1-F_Cu.gbr",
"FileFunction": "Copper,L1,Top",
"FilePolarity": "Positive"
},
{
"Path": "tp1-B_Cu.gbr",
"FileFunction": "Copper,L2,Bot",
"FilePolarity": "Positive"
},
{
"Path": "tp1-F_Paste.gbr",
"FileFunction": "SolderPaste,Top",
"FilePolarity": "Positive"
},
{
"Path": "tp1-B_Paste.gbr",
"FileFunction": "SolderPaste,Bot",
"FilePolarity": "Positive"
},
{
"Path": "tp1-F_Silkscreen.gbr",
"FileFunction": "Legend,Top",
"FilePolarity": "Positive"
},
{
"Path": "tp1-B_Silkscreen.gbr",
"FileFunction": "Legend,Bot",
"FilePolarity": "Positive"
},
{
"Path": "tp1-F_Mask.gbr",
"FileFunction": "SolderMask,Top",
"FilePolarity": "Negative"
},
{
"Path": "tp1-B_Mask.gbr",
"FileFunction": "SolderMask,Bot",
"FilePolarity": "Negative"
},
{
"Path": "tp1-Edge_Cuts.gbr",
"FileFunction": "Profile",
"FilePolarity": "Positive"
}
],
"MaterialStackup": [
{
"Type": "Legend",
"Color": "White",
"Name": "Top Silk Screen"
},
{
"Type": "SolderPaste",
"Name": "Top Solder Paste"
},
{
"Type": "SolderMask",
"Color": "Black",
"Thickness": 0.01,
"Name": "Top Solder Mask"
},
{
"Type": "Copper",
"Thickness": 0.035,
"Name": "F.Cu"
},
{
"Type": "Dielectric",
"Thickness": 1.51,
"Material": "FR4",
"Name": "F.Cu/B.Cu",
"Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)"
},
{
"Type": "Copper",
"Thickness": 0.035,
"Name": "B.Cu"
},
{
"Type": "SolderMask",
"Color": "Black",
"Thickness": 0.01,
"Name": "Bottom Solder Mask"
},
{
"Type": "SolderPaste",
"Name": "Bottom Solder Paste"
},
{
"Type": "Legend",
"Color": "White",
"Name": "Bottom Silk Screen"
}
]
}