2022-09-19 02:51:11 -04:00
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(footprint "W25Q80DVUXIE" (version 20211014) (generator pcbnew)
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(layer "F.Cu")
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(tedit 0)
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(attr smd)
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(fp_text reference "REF**" (at 0 -2.54 unlocked) (layer "F.SilkS")
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(effects (font (size 1 1) (thickness 0.15)))
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(tstamp 465137b4-f6f7-4d51-9b40-b161947d5cc1)
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)
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(fp_text value "W25Q80DVUXIE" (at 0 2.3 unlocked) (layer "F.Fab")
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(effects (font (size 1 1) (thickness 0.15)))
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(tstamp d1cd5391-31d2-459f-8adb-4ae3f304a833)
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)
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(fp_text user "${REFERENCE}" (at 0 0 unlocked) (layer "F.Fab")
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(effects (font (size 0.5 0.5) (thickness 0.08)))
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(tstamp 4086cbd7-6ba7-4e63-8da9-17e60627ee17)
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)
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(fp_rect (start -1.65 0.85) (end -1.1 0.65) (layer "F.Paste") (width 0) (fill solid) (tstamp 05fd22cb-dff4-4a8c-8f01-3428b502748b))
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(fp_rect (start -1.65 -0.15) (end -1.1 -0.35) (layer "F.Paste") (width 0) (fill solid) (tstamp 0810d445-1df3-46a9-896a-86ad16793678))
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(fp_rect (start 1.1 0.85) (end 1.65 0.65) (layer "F.Paste") (width 0) (fill solid) (tstamp 287ef878-3010-4032-8614-43b8c94551f4))
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(fp_rect (start 0.1 0.1) (end -0.1 0.6) (layer "F.Paste") (width 0) (fill solid) (tstamp 321442de-1be8-447c-864f-6a257a7c6538))
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(fp_rect (start -1.65 0.35) (end -1.1 0.15) (layer "F.Paste") (width 0) (fill solid) (tstamp c3b485fe-0f1e-46fb-b3ff-8782ddd819b9))
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(fp_rect (start 1.1 -0.65) (end 1.65 -0.85) (layer "F.Paste") (width 0) (fill solid) (tstamp ce513be5-314f-4c8a-b67c-995b4d660942))
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(fp_rect (start 1.1 0.35) (end 1.65 0.15) (layer "F.Paste") (width 0) (fill solid) (tstamp d5345ffb-e660-46fd-91a1-6d7002bcf227))
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(fp_rect (start 0.1 -0.6) (end -0.1 -0.1) (layer "F.Paste") (width 0) (fill solid) (tstamp db25ded8-11d6-4044-a831-59c0188314fb))
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(fp_rect (start 1.1 -0.15) (end 1.65 -0.35) (layer "F.Paste") (width 0) (fill solid) (tstamp fad25daf-d489-46ee-a7a9-e23c39213e36))
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(fp_rect (start -1.65 -0.65) (end -1.1 -0.85) (layer "F.Paste") (width 0) (fill solid) (tstamp fdbc71b1-4096-4d2c-99bc-b62ad2c2fdeb))
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(fp_line (start 0.7 1.1) (end -0.7 1.1) (layer "F.SilkS") (width 0.12) (tstamp 3036986f-780f-4e5b-8e4b-4e66acc1e072))
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(fp_line (start 0.7 -1.1) (end -1.225 -1.1) (layer "F.SilkS") (width 0.12) (tstamp 61e795c9-5bb5-48b3-b7a0-cb64f04c7adc))
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(fp_line (start -1.8 -1.3) (end 1.8 -1.3) (layer "F.CrtYd") (width 0.05) (tstamp 74af2938-5aa5-43d4-bb52-2d07b4b7e88e))
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(fp_line (start 1.8 1.3) (end -1.8 1.3) (layer "F.CrtYd") (width 0.05) (tstamp 773a22ae-c653-4f8d-930e-4149eabde637))
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(fp_line (start 1.8 -1.3) (end 1.8 1.3) (layer "F.CrtYd") (width 0.05) (tstamp 7844fa1c-c2e9-46d4-aee9-55128915096f))
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(fp_line (start -1.8 1.3) (end -1.8 -1.3) (layer "F.CrtYd") (width 0.05) (tstamp 9ae7e107-47c3-4f43-acc6-d14899796c06))
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TK-1 and TP-1 PCBs (#52)
* Add kicad library for flat programming clip
* Add descriptions to part symbols
* Add extended values, manufacturer/distributor info to components in mta1
* Add new board entry for TK1
* Add TP1 programmer design
* Update MTA1-USB-V1 release files to match production
* Change SPI flash memory type to XT25F08BDFIGT-S
* Change touch sensor feedback cap to 1uF
* Add manufacturer, manufacturer part number, distributor, distributor part number
* Update component values for TK1 PCB
* Use specific part # for C8
* Change flash back to Winbond part, for easier sourcing
* Change C1 to 1pF
* Fixes for production programmer PCB
* Swap GND and 5V on J3
* Replace graphic logo with text
* Rename part to 'TP-1'
* TK-1 release
* Add dimensions for PCB
* Add layer stackup for PCB
* Change PCB component origin to match expanded board
* Change schematic title to 'TK-1', update release date
* mta1-usb-v1-programmer: Add corrected part numbers for OSFC production
* Q1, Q2, F1 part subsititutions
* add mfr/supplier info for all parts
* PCB library: add parts
* Rectangular footprint for TK-1 test pads
* BOM generation script used for TK-1 and TP-1 releases
* TP-1 release
* Schematic: Add manufacturer, supplier information for all parts
* Schematic: Update name and release date
* PCB: Add PCB fabrication information
* PCB: Correct pinouts on silkscreen
* PCB library: add 'screw' and 'foot' symbols
* Screw is a schematic-only part, for including mechanical screws in the
BOM
* Foot is for self-adhesive rubber mounting feet that can be stuck to
the bottom of a PCB
* TP-1 release: Add screws, feet to the BOM
* Pico library: Add footprint for RPi Pico w/solder paste
* TP-1 RevA release updates:
* Add fiducials in 3 corners (1mm exposed copper ring w/2mm soldermask opening)
* Add solder paste openings to Raspberry Pi Pico pads
* TK-1: RevA.1 release
* Add two fiducials to TK-1 board
* TP-1: Update fuse type to match actual part
* Make placement diagrams for TP-1, TK-1
* Update BC-1-xxx footprints to include placement outlines
* Update TP-1 PCB with new footprints, clean up top fab layer
* Take screenshots of top layers of both boards
* tk-1: fix placement footprints
* Add pin1 marking for ncp footprint
* Add refdes for w25q80 footprint
* Update board with new footprints, clear extraneous text on fab layer
2022-12-22 10:41:46 -05:00
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(fp_line (start 1.5 -1) (end -1.016 -1) (layer "F.Fab") (width 0.12) (tstamp 02103ae5-54fb-4b80-a4c2-6096261b830e))
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2022-09-19 02:51:11 -04:00
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(fp_line (start 1.5 1) (end -1.5 1) (layer "F.Fab") (width 0.12) (tstamp 3ada789a-8253-4c52-ac20-d30b9efe4f49))
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(fp_line (start 1.5 -1) (end 1.5 1) (layer "F.Fab") (width 0.12) (tstamp 8d418f4a-1f96-40d9-af23-daa03b7feb31))
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TK-1 and TP-1 PCBs (#52)
* Add kicad library for flat programming clip
* Add descriptions to part symbols
* Add extended values, manufacturer/distributor info to components in mta1
* Add new board entry for TK1
* Add TP1 programmer design
* Update MTA1-USB-V1 release files to match production
* Change SPI flash memory type to XT25F08BDFIGT-S
* Change touch sensor feedback cap to 1uF
* Add manufacturer, manufacturer part number, distributor, distributor part number
* Update component values for TK1 PCB
* Use specific part # for C8
* Change flash back to Winbond part, for easier sourcing
* Change C1 to 1pF
* Fixes for production programmer PCB
* Swap GND and 5V on J3
* Replace graphic logo with text
* Rename part to 'TP-1'
* TK-1 release
* Add dimensions for PCB
* Add layer stackup for PCB
* Change PCB component origin to match expanded board
* Change schematic title to 'TK-1', update release date
* mta1-usb-v1-programmer: Add corrected part numbers for OSFC production
* Q1, Q2, F1 part subsititutions
* add mfr/supplier info for all parts
* PCB library: add parts
* Rectangular footprint for TK-1 test pads
* BOM generation script used for TK-1 and TP-1 releases
* TP-1 release
* Schematic: Add manufacturer, supplier information for all parts
* Schematic: Update name and release date
* PCB: Add PCB fabrication information
* PCB: Correct pinouts on silkscreen
* PCB library: add 'screw' and 'foot' symbols
* Screw is a schematic-only part, for including mechanical screws in the
BOM
* Foot is for self-adhesive rubber mounting feet that can be stuck to
the bottom of a PCB
* TP-1 release: Add screws, feet to the BOM
* Pico library: Add footprint for RPi Pico w/solder paste
* TP-1 RevA release updates:
* Add fiducials in 3 corners (1mm exposed copper ring w/2mm soldermask opening)
* Add solder paste openings to Raspberry Pi Pico pads
* TK-1: RevA.1 release
* Add two fiducials to TK-1 board
* TP-1: Update fuse type to match actual part
* Make placement diagrams for TP-1, TK-1
* Update BC-1-xxx footprints to include placement outlines
* Update TP-1 PCB with new footprints, clean up top fab layer
* Take screenshots of top layers of both boards
* tk-1: fix placement footprints
* Add pin1 marking for ncp footprint
* Add refdes for w25q80 footprint
* Update board with new footprints, clear extraneous text on fab layer
2022-12-22 10:41:46 -05:00
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(fp_line (start -1.5 -0.508) (end -1.016 -1) (layer "F.Fab") (width 0.12) (tstamp dfda12f7-e1a6-4950-9d78-27db7450d1a3))
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(fp_line (start -1.5 -0.508) (end -1.5 1) (layer "F.Fab") (width 0.12) (tstamp f149694e-4336-45f7-8a0b-aed91118ad18))
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2022-09-19 02:51:11 -04:00
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(pad "1" smd roundrect (at -1.25 -0.75) (size 0.6 0.3) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.25) (tstamp 7983b95c-14e4-4dec-ab4e-09c81071d9de))
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(pad "2" smd roundrect (at -1.25 -0.25) (size 0.6 0.3) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.25) (tstamp 3997254a-8057-4464-ba07-e37f0720cbd8))
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(pad "3" smd roundrect (at -1.25 0.25) (size 0.6 0.3) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.25) (tstamp a9ff0621-eacb-4187-ba89-29f236eec881))
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(pad "4" smd roundrect (at -1.25 0.75) (size 0.6 0.3) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.25) (tstamp 8eacb9d3-c41d-4b39-abd1-0bc8f2e97411))
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(pad "5" smd roundrect (at 1.25 0.75) (size 0.6 0.3) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.25) (tstamp d3db736b-0e33-4126-b950-5488923df40e))
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(pad "6" smd roundrect (at 1.25 0.25) (size 0.6 0.3) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.25) (tstamp f7475c2a-e91e-435c-bec2-3307ef3e1f94))
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(pad "7" smd roundrect (at 1.25 -0.25) (size 0.6 0.3) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.25) (tstamp a16dbf15-8f5b-4766-b048-90ba89efcc02))
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(pad "8" smd roundrect (at 1.25 -0.75) (size 0.6 0.3) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.25) (tstamp cf45f134-35c0-4b31-91e7-048e45f34bf8))
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(pad "9" smd roundrect (at 0 0 180) (size 0.3 1.7) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.25) (tstamp d1f81642-eb3a-4277-b357-9cbb5a3aa5ac))
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(model "${KIPRJMOD}/../mta1-library/mta1.pretty/3d_models/USON_2X3.step"
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(offset (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz -90 0 0))
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)
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)
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